Case 1178 ยท Public preview
A Thin, Oxidized Lead Finish Can Produce a Weak Solder Interface
Multiple components detached from circuit boards after assembly, leaving fractures at the component-lead-to-solder interface.
SEMEDSFracture-surface analysisMicrosectioningCoating-thickness measurementFailed-stock comparison
What the evidence preview establishes
Poor component-lead solderability created weak lead-to-solder interfaces. Contributing conditions included an unusually thin and nonuniform tin-lead finish, copper-tin intermetallic exposed at the surface, and substantial oxidation and chloride contamination.
Why this case matters
Evaluate detached components at the lead-to-solder interface and examine unsoldered stock. Finish thickness, uniformity, oxidation, contamination, and intermetallic breakthrough must be considered together when assessing solderability.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.