Extreme Board-Normal Shock Can Break Both Adhesive Bonds and Solder Joints

What the evidence preview establishes

Mechanical overload normal to the board fractured adhesive bonds and, at some locations, solder joints. The evidence did not support fatigue or contamination. Nonuniform adhesive application could have amplified local stress but did not fully explain damage across separate component groups.

Why this case matters

For shock failures, map attachment damage against component mass and board position. Verify the input at the assembly, measure board response, and control adhesive geometry before treating nominal acceleration as the complete mechanical load.