Case 2305 ยท Public preview
Electrochemical Migration Can Develop Inside a Filled-Resin PWB Layer
Circuit boards developed destructive shorts and severe internal copper damage near a buried 24-volt trace.
Electrical fault localizationOptical microscopyProgressive microsectioningSEMEDS
What the evidence preview establishes
Chloride contamination within filled resin near an internal layer most likely accelerated electrochemical migration and corrosion, culminating in a high-energy short between buried conductors.
Why this case matters
An internal board short may begin as a low-energy ionic process long before copper vaporizes. Examine filled-resin and fiber interfaces beyond the visibly burned region and control contamination before lamination.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.