Case 1349 · Public preview
An Inadequately Filled Via Can Consume Nearly an Entire BGA Solder Ball
X-ray examination of compact circuit modules identified anomalous BGA locations that were electrically open, while another module without the anomalies was retained as a comparison.
X-ray imagingMetallographic microsectioningOptical microscopyBSE SEMSolder-volume estimation
What the evidence preview establishes
The opens resulted from inadequate PWB via fill. During assembly, solder wicked into the affected vias and removed approximately 90–92% of the available solder-ball volume, leaving insufficient solder to form the intended BGA connections.
Why this case matters
When X-ray shows an unusual BGA shape near a via-in-pad or closely coupled via, section the entire vertical path. A visually small fill defect can redirect nearly all available solder and create an open even when solder was originally deposited at the joint.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, 5 interpreted figures, alternative explanations, limitations, and practical application guidance.