Case 1833 ยท Public preview
Failure Analysis Must Also Establish When a Suspected BGA Is Sound
A BGA assembly was suspected of causing reported equipment failures, but the implicated electrical fault had not been localized.
BGA microsectioningSEMMechanical pull-off examinationEDSPackage and PWB inspection
What the evidence preview establishes
The available physical evidence did not support the BGA solder joints as the primary failure cause. The investigation needed electrical localization before additional destructive analysis.
Why this case matters
Do not convert a suspected component location into a root cause. First identify the symptom and failed signal, verify the electrical fault, and then direct physical analysis to the responsible net or interface.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.