Case 2537 ยท Public preview
Internal Bond-Wire Damage Can Fail a BGA with Intact Solder Joints
A BGA device failed electrically even though destructive joint examination found no solder-joint integrity problem.
BGA removalSEMEDSStaged chemical decapsulationOptical microscopyDamage-pattern comparison
What the evidence preview establishes
Internal bond wires were swept together and mechanically damaged near one die corner. Broken wires created direct open paths. Injury occurred after wire bonding but before molding; molding flow subsequently swept the wires.
Why this case matters
A BGA-area failure is not necessarily a solder-joint problem. Use staged decapsulation to distinguish molding-flow wire sweep from pre-existing mechanical injury and constrain the manufacturing window.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.