{
    "query": "Solder-Flux-Associated Failures in Electronic Assemblies",
    "total": 20,
    "limit": 10,
    "catalog_generated_at": "2026-09-17T18:09:54Z",
    "results": [
        {
            "report_id": "SEM-EVIDENCE-0019",
            "slug": "solder-flux-associated-failures-sample-report",
            "title": "Solder-Flux-Associated Failures in Electronic Assemblies",
            "abstract": "This free 10-page sample report demonstrates how SEM Lab connects electrical behavior, failure-site location, SEM imaging, EDS chemistry, process history, and evidence limits in a clear technical deliverable. Six anonymized cases show how retained solder-flux residue can contribute to moisture-sensitive leakage, corrosion, electrochemical migration, and combined manufacturing defects. The report also provides a failure-analysis sequence and practical process controls. It is published as a composite marketing example so prospective clients can evaluate the structure, evidence traceability, and calibrated conclusion language used in SEM Lab technical reporting.",
            "failure_modes": [
                "moisture-sensitive leakage",
                "corrosion",
                "electrochemical migration",
                "flux entrapment"
            ],
            "technologies": [
                "solder-flux-associated failures in electronic assemblies",
                "flux residue",
                "corrosion",
                "electrochemical migration",
                "electrical leakage",
                "cleaning",
                "drying",
                "SEM",
                "EDS",
                "evidence interpretation"
            ],
            "materials": [
                "solder flux residue",
                "copper",
                "immersion silver",
                "solder mask"
            ],
            "methods": [
                "electrical testing",
                "optical microscopy",
                "SEM",
                "EDS",
                "cross-sectioning",
                "ion chromatography"
            ],
            "keywords": [
                "solder-flux-associated failures in electronic assemblies",
                "flux residue",
                "corrosion",
                "electrochemical migration",
                "electrical leakage",
                "cleaning",
                "drying",
                "SEM",
                "EDS",
                "evidence interpretation",
                "moisture-sensitive leakage",
                "flux entrapment",
                "solder flux residue",
                "copper",
                "immersion silver",
                "solder mask",
                "electrical testing",
                "optical microscopy",
                "cross-sectioning",
                "ion chromatography"
            ],
            "audience": [
                "failure-analysis engineers",
                "manufacturing engineers",
                "process engineers",
                "reliability engineers",
                "quality engineers",
                "technical managers"
            ],
            "availability": [
                "free_public_download"
            ],
            "price": null,
            "purchase_url": "https://www.semlab.com/assets/sample-report/solder-flux-associated-failures-sample-report.pdf",
            "page_url": "https://www.semlab.com/sample-failure-analysis-report.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0013",
            "slug": "images-of-failures-in-microelectronics-packaging",
            "title": "Images of Failures in Microelectronics Packaging",
            "abstract": "This paper is positioned as a collection of failures seen at SEM Lab in microelectronics packaging. The source page states that it includes examples such as gold embrittlement, mechanical damage, solder-joint failure, black pad syndrome, and various other failure mechanisms. That makes the paper useful as a broad visual and mechanism-oriented reference rather than a narrowly focused single-topic treatment. It appears to function as a consolidated packaging-failure example set.",
            "failure_modes": [
                "gold embrittlement",
                "mechanical damage",
                "black pad",
                "solder-joint failure"
            ],
            "technologies": [
                "failures in microelectronics packaging",
                "gold embrittlement",
                "mechanical damage",
                "solder-joint failure",
                "black pad syndrome",
                "packaging failure mechanisms",
                "image examples"
            ],
            "materials": [
                "microelectronics packaging",
                "solder"
            ],
            "methods": [
                "SEM",
                "visual comparison"
            ],
            "keywords": [
                "failures in microelectronics packaging",
                "gold embrittlement",
                "mechanical damage",
                "solder-joint failure",
                "black pad syndrome",
                "packaging failure mechanisms",
                "image examples",
                "black pad",
                "microelectronics packaging",
                "solder",
                "SEM",
                "visual comparison"
            ],
            "audience": [
                "electronics failure-analysis engineers",
                "packaging engineers",
                "reliability engineers",
                "manufacturing engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "320.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/images-of-failures-in-microelectronics-packaging.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0016",
            "slug": "solder-flux-residue-part-1",
            "title": "Solder Flux Residue - Part 1",
            "abstract": "This paper covers solder flux residue left on printed circuit board assemblies and the problems it can cause, including corrosion, electro-chemical migration, electrical leakage, and short-circuit faults. The source page also makes clear that the paper investigates what conclusions can be drawn from EDS data for solder flux residue. That gives the paper practical value beyond simple contamination awareness. It helps connect residue, analytical evidence, and engineering interpretation in cases where the contamination mechanism matters.",
            "failure_modes": [
                "corrosion",
                "electrochemical migration",
                "electrical leakage",
                "short circuit"
            ],
            "technologies": [
                "solder flux residue",
                "corrosion",
                "electro-chemical migration",
                "electrical leakage",
                "short-circuit faults",
                "SEM/EDS interpretation"
            ],
            "materials": [
                "solder flux residue",
                "printed circuit board assembly"
            ],
            "methods": [
                "SEM",
                "EDS"
            ],
            "keywords": [
                "solder flux residue",
                "corrosion",
                "electro-chemical migration",
                "electrical leakage",
                "short-circuit faults",
                "SEM/EDS interpretation",
                "electrochemical migration",
                "short circuit",
                "printed circuit board assembly",
                "SEM",
                "EDS"
            ],
            "audience": [
                "failure-analysis engineers",
                "manufacturing engineers",
                "quality engineers",
                "materials engineers",
                "reliability engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "15.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/solder-flux-residue-part-1.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0002",
            "slug": "diffusion-barrier-plating-in-electronics",
            "title": "Diffusion Barrier Plating in Electronics",
            "abstract": "This paper covers the use of diffusion barriers in electronics manufacturing and the practical reasons they matter. The source page notes that diffusion barriers have been used for decades, but that SEM Lab still sees cases where barrier layers are omitted when they likely should have been used. The page positions the paper as a series of examples illustrating diffusion-barrier use in electronics manufacturing and links the issue directly to soldering-process quality and solder-joint reliability. That makes the paper useful both as a microstructural reference and as a process-selection reference.",
            "failure_modes": [
                "barrier-layer omission",
                "interfacial degradation"
            ],
            "technologies": [
                "diffusion barrier plating in electronics",
                "plating systems",
                "solder-joint reliability",
                "microstructural evaluation",
                "barrier layers",
                "manufacturing process quality"
            ],
            "materials": [
                "diffusion-barrier plating",
                "solder"
            ],
            "methods": [
                "SEM",
                "metallographic cross-sectioning"
            ],
            "keywords": [
                "diffusion barrier plating in electronics",
                "plating systems",
                "solder-joint reliability",
                "microstructural evaluation",
                "barrier layers",
                "manufacturing process quality",
                "barrier-layer omission",
                "interfacial degradation",
                "diffusion-barrier plating",
                "solder",
                "SEM",
                "metallographic cross-sectioning"
            ],
            "audience": [
                "electronics failure-analysis engineers",
                "manufacturing engineers",
                "materials engineers",
                "plating engineers",
                "reliability engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "30.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/diffusion-barrier-plating-in-electronics.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0017",
            "slug": "solder-flux-residue-part-2",
            "title": "Solder Flux Residue - Part 2",
            "abstract": "This paper extends the solder-flux-residue topic by examining how to interpret EDS data when the electron beam can penetrate thin residue layers and include contribution from the solder mask underneath. The source page specifically frames the paper around removing that solder-mask contribution from the analysis. That makes Part 2 a useful companion to Part 1 rather than a repeat. It is focused more narrowly on how to interpret the data correctly when residue is present on a PCBA surface.",
            "failure_modes": [
                "contamination",
                "analytical interference"
            ],
            "technologies": [
                "solder flux residue",
                "EDS interpretation",
                "solder-mask contribution",
                "contamination analysis",
                "corrosion",
                "leakage analysis"
            ],
            "materials": [
                "solder flux residue",
                "solder mask"
            ],
            "methods": [
                "SEM",
                "EDS",
                "background correction"
            ],
            "keywords": [
                "solder flux residue",
                "EDS interpretation",
                "solder-mask contribution",
                "contamination analysis",
                "corrosion",
                "leakage analysis",
                "contamination",
                "analytical interference",
                "solder mask",
                "SEM",
                "EDS",
                "background correction"
            ],
            "audience": [
                "failure-analysis engineers",
                "manufacturing engineers",
                "quality engineers",
                "materials engineers",
                "reliability engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "15.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/solder-flux-residue-part-2.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0020",
            "slug": "solder-mask-defects-electrical-failure",
            "title": "Solder Mask Defects and Their Role in Electrical Failure",
            "abstract": "This case-based paper explains when solder-mask defects contribute directly to electrical failure and when mask condition is only one factor in a mixed-cause investigation. It connects incomplete coverage, aperture misregistration, incomplete via tenting, mechanical damage, contamination, and below-mask corrosion with physical evidence from eight anonymized SEM Lab cases. The paper emphasizes that mask thickness, composition, cracking, blistering, or EDS detection of mask constituents does not independently establish root cause. Defensible conclusions must also agree with the electrical path, board geometry, conductor clearance, contamination, moisture, voltage stress, process history, and comparison samples.",
            "failure_modes": [
                "hi-pot breakdown",
                "corrosion",
                "open circuit",
                "electrical leakage",
                "solder-joint geometry distortion"
            ],
            "technologies": [
                "solder mask defects and electrical failure",
                "incomplete solder-mask coverage",
                "hi-pot breakdown",
                "aperture misregistration",
                "BGA solder-joint geometry",
                "incomplete via tenting",
                "corrosion",
                "ionic contamination",
                "electrical leakage",
                "conductor clearance",
                "SEM/EDS interpretation"
            ],
            "materials": [
                "solder mask",
                "copper conductors",
                "printed wiring boards",
                "flux residue"
            ],
            "methods": [
                "optical microscopy",
                "SEM",
                "EDS",
                "cross-sectioning",
                "electrical failure localization"
            ],
            "keywords": [
                "solder mask defects and electrical failure",
                "incomplete solder-mask coverage",
                "hi-pot breakdown",
                "aperture misregistration",
                "BGA solder-joint geometry",
                "incomplete via tenting",
                "corrosion",
                "ionic contamination",
                "electrical leakage",
                "conductor clearance",
                "SEM/EDS interpretation",
                "open circuit",
                "solder-joint geometry distortion",
                "solder mask",
                "copper conductors",
                "printed wiring boards",
                "flux residue",
                "optical microscopy",
                "SEM",
                "EDS",
                "cross-sectioning",
                "electrical failure localization"
            ],
            "audience": [
                "failure-analysis engineers",
                "reliability engineers",
                "printed-circuit-board engineers",
                "manufacturing engineers",
                "process engineers",
                "quality engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "60.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/solder-mask-defects-electrical-failure.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-03"
        },
        {
            "report_id": "SEM-EVIDENCE-0014",
            "slug": "intermetallics-in-solder-joints",
            "title": "Intermetallics in Solder Joints",
            "abstract": "This paper explains why intermetallic compounds in solder joints are not a simple \"good\" or \"bad\" issue. It covers the basic role of intermetallic layers, why excessive intermetallic formation can damage joint performance, and why the absence of expected interfacial intermetallics can indicate a process or material problem. The paper discusses several intermetallic systems that are important in electronics work, including Cu6Sn5, Cu3Sn, Ni3Sn4, AuSn4, and Ag3Sn. It also includes discussion of gold embrittlement, volume-fraction effects, and ternary intermetallic phases that can contribute to brittle interfacial behavior.",
            "failure_modes": [
                "excessive intermetallic growth",
                "brittle interfacial fracture"
            ],
            "technologies": [
                "solder-joint intermetallic compounds",
                "gold embrittlement",
                "Cu-Sn intermetallics",
                "Ni-Sn intermetallics",
                "Ag-Sn intermetallics",
                "interfacial solder-joint microstructure"
            ],
            "materials": [
                "Cu6Sn5",
                "Cu3Sn",
                "Ni3Sn4",
                "AuSn4",
                "Ag3Sn"
            ],
            "methods": [
                "metallographic cross-sectioning",
                "SEM",
                "EDS"
            ],
            "keywords": [
                "solder-joint intermetallic compounds",
                "gold embrittlement",
                "Cu-Sn intermetallics",
                "Ni-Sn intermetallics",
                "Ag-Sn intermetallics",
                "interfacial solder-joint microstructure",
                "excessive intermetallic growth",
                "brittle interfacial fracture",
                "Cu6Sn5",
                "Cu3Sn",
                "Ni3Sn4",
                "AuSn4",
                "Ag3Sn",
                "metallographic cross-sectioning",
                "SEM",
                "EDS"
            ],
            "audience": [
                "electronics failure-analysis engineers",
                "manufacturing engineers",
                "materials engineers",
                "reliability engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "45.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/intermetallics-in-solder-joints.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0011",
            "slug": "gold-embrittlement-of-solder-joints",
            "title": "Gold Embrittlement of Solder Joints",
            "abstract": "This expanded paper draws on solder-joint investigations performed over more than 20 years. It examines eutectic tin-lead, SN62, Sn-Ag, and SAC305 joints using BSE SEM imaging, EDS, image analysis, fracture-surface examination, plating cross-sections, and mass-balance calculations. The paper treats approximately 3 wt% gold as a useful screening value while showing why average gold concentration alone can be misleading. Case evidence includes localized Au-Sn segregation below the calculated joint average, agreement and disagreement between chemistry and image area, Cu- and Ni-bearing reaction products in lead-free systems, an extreme SAC305 transformation, thin die-attach damage during cool-down, anomalous connector plating, thermal-aging effects, and low-gold comparison cases.",
            "failure_modes": [
                "gold embrittlement",
                "brittle solder-joint fracture"
            ],
            "technologies": [
                "gold embrittlement of tin-based solder joints",
                "AuSn4",
                "AuSn2",
                "gold inventory",
                "intermetallic volume fraction",
                "Sn-Pb",
                "SN62",
                "Sn-Ag",
                "SAC305",
                "Cu-bearing reaction products",
                "SEM/EDS",
                "BSE imaging",
                "image analysis",
                "fracture surfaces",
                "thermal aging",
                "plating verification"
            ],
            "materials": [
                "gold",
                "solder",
                "intermetallic compounds"
            ],
            "methods": [
                "metallographic cross-sectioning",
                "SEM",
                "EDS"
            ],
            "keywords": [
                "gold embrittlement of tin-based solder joints",
                "AuSn4",
                "AuSn2",
                "gold inventory",
                "intermetallic volume fraction",
                "Sn-Pb",
                "SN62",
                "Sn-Ag",
                "SAC305",
                "Cu-bearing reaction products",
                "SEM/EDS",
                "BSE imaging",
                "image analysis",
                "fracture surfaces",
                "thermal aging",
                "plating verification",
                "gold embrittlement",
                "brittle solder-joint fracture",
                "gold",
                "solder",
                "intermetallic compounds",
                "metallographic cross-sectioning",
                "SEM",
                "EDS"
            ],
            "audience": [
                "failure-analysis engineers",
                "materials engineers",
                "reliability engineers",
                "soldering-process engineers",
                "electronics-packaging engineers",
                "manufacturing engineers",
                "quality engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "150.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/gold-embrittlement-of-solder-joints.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0021",
            "slug": "physical-composition-inorganic-fillers-solder-mask",
            "title": "Physical Composition of Inorganic Fillers in Printed Circuit Solder Mask",
            "abstract": "This paper converts archived SEM/EDS elemental measurements into estimated physical phase fractions for printed-circuit solder mask. The clean/reference cohort indicates approximately 10-11 vol% total inorganic filler in the modeled mask, with barium sulfate as the principal fitted filler and silica as a smaller but persistent secondary constituent. The paper explains the constrained-regression, stoichiometric, molar-mass, and density basis used to move from ZAF-corrected atomic percentages to mole, weight, and volume fractions. It also separates clean/reference acquisitions from residue-on-mask spectra and states the limits of localized SEM/EDS measurements, the binder surrogate, phase identification, and the small number of independent cases.",
            "failure_modes": [
                "solder-mask formulation variation",
                "solder-mask cracking",
                "adhesion loss"
            ],
            "technologies": [
                "physical composition of inorganic fillers in printed circuit solder mask",
                "solder-mask formulation",
                "barium sulfate filler",
                "silica filler",
                "filler volume fraction",
                "SEM/EDS interpretation",
                "constrained regression",
                "materials engineering",
                "process comparison"
            ],
            "materials": [
                "solder mask",
                "barium sulfate",
                "silica",
                "epoxy binder"
            ],
            "methods": [
                "SEM",
                "EDS",
                "nonnegative constrained regression",
                "stoichiometric mass-balance analysis"
            ],
            "keywords": [
                "physical composition of inorganic fillers in printed circuit solder mask",
                "solder-mask formulation",
                "barium sulfate filler",
                "silica filler",
                "filler volume fraction",
                "SEM/EDS interpretation",
                "constrained regression",
                "materials engineering",
                "process comparison",
                "solder-mask formulation variation",
                "solder-mask cracking",
                "adhesion loss",
                "solder mask",
                "barium sulfate",
                "silica",
                "epoxy binder",
                "SEM",
                "EDS",
                "nonnegative constrained regression",
                "stoichiometric mass-balance analysis"
            ],
            "audience": [
                "printed-circuit-board engineers",
                "materials engineers",
                "manufacturing engineers",
                "process engineers",
                "failure-analysis engineers",
                "reliability engineers",
                "quality engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "30.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/physical-composition-inorganic-fillers-solder-mask.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-09-17"
        },
        {
            "report_id": "SEM-EVIDENCE-0018",
            "slug": "solder-joint-analysis",
            "title": "Solder Joint Analysis",
            "abstract": "This paper covers techniques for analyzing solder joints and highlights SEM Lab capabilities in solder-joint evaluation and failure analysis. The source page specifically identifies metallurgical cross-sectioning, SEM/EDS analysis, failure analysis, and computational metallurgical analysis as part of the paper's scope. The page also states that the analysis results are essential for credible design, process, and product failure analysis. That positions the paper as a broad solder-joint reference rather than a narrow mechanism note.",
            "failure_modes": [
                "solder-joint failure",
                "metallurgical defects"
            ],
            "technologies": [
                "solder joint analysis",
                "metallurgical cross-sectioning",
                "SEM/EDS",
                "solder-joint failure analysis",
                "computational metallurgical analysis",
                "design and process evaluation"
            ],
            "materials": [
                "solder",
                "intermetallic compounds"
            ],
            "methods": [
                "metallurgical cross-sectioning",
                "SEM",
                "EDS",
                "computational metallurgical analysis"
            ],
            "keywords": [
                "solder joint analysis",
                "metallurgical cross-sectioning",
                "SEM/EDS",
                "solder-joint failure analysis",
                "computational metallurgical analysis",
                "design and process evaluation",
                "solder-joint failure",
                "metallurgical defects",
                "solder",
                "intermetallic compounds",
                "SEM",
                "EDS"
            ],
            "audience": [
                "failure-analysis engineers",
                "manufacturing engineers",
                "materials engineers",
                "reliability engineers",
                "product engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "55.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/solder-joint-analysis.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        }
    ]
}