{
    "query": "Solder Joint Analysis",
    "total": 18,
    "limit": 10,
    "catalog_generated_at": "2026-08-01T15:46:10Z",
    "results": [
        {
            "report_id": "SEM-EVIDENCE-0018",
            "slug": "solder-joint-analysis",
            "title": "Solder Joint Analysis",
            "abstract": "This paper covers techniques for analyzing solder joints and highlights SEM Lab capabilities in solder-joint evaluation and failure analysis. The source page specifically identifies metallurgical cross-sectioning, SEM/EDS analysis, failure analysis, and computational metallurgical analysis as part of the paper's scope. The page also states that the analysis results are essential for credible design, process, and product failure analysis. That positions the paper as a broad solder-joint reference rather than a narrow mechanism note.",
            "failure_modes": [
                "solder-joint failure",
                "metallurgical defects"
            ],
            "technologies": [
                "solder joint analysis",
                "metallurgical cross-sectioning",
                "SEM/EDS",
                "solder-joint failure analysis",
                "computational metallurgical analysis",
                "design and process evaluation"
            ],
            "materials": [
                "solder",
                "intermetallic compounds"
            ],
            "methods": [
                "metallurgical cross-sectioning",
                "SEM",
                "EDS",
                "computational metallurgical analysis"
            ],
            "keywords": [
                "solder joint analysis",
                "metallurgical cross-sectioning",
                "SEM/EDS",
                "solder-joint failure analysis",
                "computational metallurgical analysis",
                "design and process evaluation",
                "solder-joint failure",
                "metallurgical defects",
                "solder",
                "intermetallic compounds",
                "SEM",
                "EDS"
            ],
            "audience": [
                "failure-analysis engineers",
                "manufacturing engineers",
                "materials engineers",
                "reliability engineers",
                "product engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "55.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/solder-joint-analysis.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0011",
            "slug": "gold-embrittlement-of-solder-joints",
            "title": "Gold Embrittlement of Solder Joints",
            "abstract": "This paper covers gold embrittlement of solder joints as a recurring and still significant electronics failure-analysis problem. The source page notes that gold-embrittlement-related failures represent a significant portion of the work analyzed at SEM Lab and states that the paper provides a detailed account of material and process parameters that can lead to this condition in electronic assemblies. The paper appears to be positioned both as a practical failure-analysis reference and as a prevention-oriented document for understanding how solder-joint design and process choices can avoid embrittlement problems.",
            "failure_modes": [
                "gold embrittlement",
                "brittle solder-joint fracture"
            ],
            "technologies": [
                "gold embrittlement in solder joints",
                "solder-joint failure",
                "intermetallic compounds",
                "process parameters",
                "material parameters",
                "electronic assemblies"
            ],
            "materials": [
                "gold",
                "solder",
                "intermetallic compounds"
            ],
            "methods": [
                "metallographic cross-sectioning",
                "SEM",
                "EDS"
            ],
            "keywords": [
                "gold embrittlement in solder joints",
                "solder-joint failure",
                "intermetallic compounds",
                "process parameters",
                "material parameters",
                "electronic assemblies",
                "gold embrittlement",
                "brittle solder-joint fracture",
                "gold",
                "solder",
                "metallographic cross-sectioning",
                "SEM",
                "EDS"
            ],
            "audience": [
                "electronics failure-analysis engineers",
                "manufacturing engineers",
                "materials engineers",
                "reliability engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "60.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/gold-embrittlement-of-solder-joints.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0014",
            "slug": "intermetallics-in-solder-joints",
            "title": "Intermetallics in Solder Joints",
            "abstract": "This paper explains why intermetallic compounds in solder joints are not a simple \"good\" or \"bad\" issue. It covers the basic role of intermetallic layers, why excessive intermetallic formation can damage joint performance, and why the absence of expected interfacial intermetallics can indicate a process or material problem. The paper discusses several intermetallic systems that are important in electronics work, including Cu6Sn5, Cu3Sn, Ni3Sn4, AuSn4, and Ag3Sn. It also includes discussion of gold embrittlement, volume-fraction effects, and ternary intermetallic phases that can contribute to brittle interfacial behavior.",
            "failure_modes": [
                "excessive intermetallic growth",
                "brittle interfacial fracture"
            ],
            "technologies": [
                "solder-joint intermetallic compounds",
                "gold embrittlement",
                "Cu-Sn intermetallics",
                "Ni-Sn intermetallics",
                "Ag-Sn intermetallics",
                "interfacial solder-joint microstructure"
            ],
            "materials": [
                "Cu6Sn5",
                "Cu3Sn",
                "Ni3Sn4",
                "AuSn4",
                "Ag3Sn"
            ],
            "methods": [
                "metallographic cross-sectioning",
                "SEM",
                "EDS"
            ],
            "keywords": [
                "solder-joint intermetallic compounds",
                "gold embrittlement",
                "Cu-Sn intermetallics",
                "Ni-Sn intermetallics",
                "Ag-Sn intermetallics",
                "interfacial solder-joint microstructure",
                "excessive intermetallic growth",
                "brittle interfacial fracture",
                "Cu6Sn5",
                "Cu3Sn",
                "Ni3Sn4",
                "AuSn4",
                "Ag3Sn",
                "metallographic cross-sectioning",
                "SEM",
                "EDS"
            ],
            "audience": [
                "electronics failure-analysis engineers",
                "manufacturing engineers",
                "materials engineers",
                "reliability engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "45.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/intermetallics-in-solder-joints.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0004",
            "slug": "failure-analysis-of-bgas",
            "title": "Failure Analysis of BGAs",
            "abstract": "This paper covers practical approaches for failure analysis of Ball Grid Array devices. The source page describes BGA analysis as difficult because of the high I/O count and packaging density, and it positions the paper as a discussion of several BGA failure modes and analysis approaches that can be performed with a limited number of analytical tools. The paper also appears to distinguish between cases that can be addressed with limited tools such as a DMM, microsectioning, and SEM/EDS, and cases where more advanced work is needed to identify the failure cause.",
            "failure_modes": [
                "BGA open circuit",
                "BGA short circuit",
                "solder-joint fracture"
            ],
            "technologies": [
                "BGA failure analysis",
                "BGA solder-joint failure modes",
                "limited-tools analysis",
                "microsectioning",
                "SEM/EDS",
                "electrical screening"
            ],
            "materials": [
                "solder"
            ],
            "methods": [
                "electrical screening",
                "microsectioning",
                "SEM",
                "EDS"
            ],
            "keywords": [
                "BGA failure analysis",
                "BGA solder-joint failure modes",
                "limited-tools analysis",
                "microsectioning",
                "SEM/EDS",
                "electrical screening",
                "BGA open circuit",
                "BGA short circuit",
                "solder-joint fracture",
                "solder",
                "SEM",
                "EDS"
            ],
            "audience": [
                "electronics failure-analysis engineers",
                "reliability engineers",
                "manufacturing engineers",
                "component engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "45.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/failure-analysis-of-bgas.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0017",
            "slug": "solder-flux-residue-part-2",
            "title": "Solder Flux Residue - Part 2",
            "abstract": "This paper extends the solder-flux-residue topic by examining how to interpret EDS data when the electron beam can penetrate thin residue layers and include contribution from the solder mask underneath. The source page specifically frames the paper around removing that solder-mask contribution from the analysis. That makes Part 2 a useful companion to Part 1 rather than a repeat. It is focused more narrowly on how to interpret the data correctly when residue is present on a PCBA surface.",
            "failure_modes": [
                "contamination",
                "analytical interference"
            ],
            "technologies": [
                "solder flux residue",
                "EDS interpretation",
                "solder-mask contribution",
                "contamination analysis",
                "corrosion",
                "leakage analysis"
            ],
            "materials": [
                "solder flux residue",
                "solder mask"
            ],
            "methods": [
                "SEM",
                "EDS",
                "background correction"
            ],
            "keywords": [
                "solder flux residue",
                "EDS interpretation",
                "solder-mask contribution",
                "contamination analysis",
                "corrosion",
                "leakage analysis",
                "contamination",
                "analytical interference",
                "solder mask",
                "SEM",
                "EDS",
                "background correction"
            ],
            "audience": [
                "failure-analysis engineers",
                "manufacturing engineers",
                "quality engineers",
                "materials engineers",
                "reliability engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "15.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/solder-flux-residue-part-2.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0006",
            "slug": "failure-analysis-of-pcbas",
            "title": "Failure Analysis of PCBAs",
            "abstract": "This paper covers practical failure-analysis approaches for printed circuit board assemblies. The source page outlines a general workflow that includes documentation review, microscope examination, electrical isolation or verification of the failure, cross-sectioning for PWB-related failures, decapsulation or cross-sectioning for component-related failures, and SEM/EDS work to document the failure site and resolve root cause. The page also includes practical \"dos and don'ts\" intended to improve the timeliness and cost effectiveness of PCBA failure analysis. That makes the paper useful not only as a mechanism reference, but also as a guide to handling, documentation, and pre-analysis discipline.",
            "failure_modes": [
                "contamination",
                "corrosion",
                "assembly failure"
            ],
            "technologies": [
                "PCBA failure analysis",
                "documentation review",
                "stereomicroscope examination",
                "electrical verification",
                "cross-sectioning",
                "decapsulation",
                "contamination",
                "corrosion",
                "SEM/EDS",
                "failure-analysis workflow"
            ],
            "materials": [
                "printed circuit board assemblies",
                "solder"
            ],
            "methods": [
                "stereomicroscopy",
                "electrical verification",
                "cross-sectioning",
                "SEM",
                "EDS"
            ],
            "keywords": [
                "PCBA failure analysis",
                "documentation review",
                "stereomicroscope examination",
                "electrical verification",
                "cross-sectioning",
                "decapsulation",
                "contamination",
                "corrosion",
                "SEM/EDS",
                "failure-analysis workflow",
                "assembly failure",
                "printed circuit board assemblies",
                "solder",
                "stereomicroscopy",
                "SEM",
                "EDS"
            ],
            "audience": [
                "electronics failure-analysis engineers",
                "reliability engineers",
                "manufacturing engineers",
                "quality engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "25.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/failure-analysis-of-pcbas.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0019",
            "slug": "solder-flux-associated-failures-sample-report",
            "title": "Solder-Flux-Associated Failures in Electronic Assemblies",
            "abstract": "This free 10-page sample report demonstrates how SEM Lab connects electrical behavior, failure-site location, SEM imaging, EDS chemistry, process history, and evidence limits in a clear technical deliverable. Six anonymized cases show how retained solder-flux residue can contribute to moisture-sensitive leakage, corrosion, electrochemical migration, and combined manufacturing defects. The report also provides a failure-analysis sequence and practical process controls. It is published as a composite marketing example so prospective clients can evaluate the structure, evidence traceability, and calibrated conclusion language used in SEM Lab technical reporting.",
            "failure_modes": [
                "moisture-sensitive leakage",
                "corrosion",
                "electrochemical migration",
                "flux entrapment"
            ],
            "technologies": [
                "solder-flux-associated failures in electronic assemblies",
                "flux residue",
                "corrosion",
                "electrochemical migration",
                "electrical leakage",
                "cleaning",
                "drying",
                "SEM",
                "EDS",
                "evidence interpretation"
            ],
            "materials": [
                "solder flux residue",
                "copper",
                "immersion silver",
                "solder mask"
            ],
            "methods": [
                "electrical testing",
                "optical microscopy",
                "SEM",
                "EDS",
                "cross-sectioning",
                "ion chromatography"
            ],
            "keywords": [
                "solder-flux-associated failures in electronic assemblies",
                "flux residue",
                "corrosion",
                "electrochemical migration",
                "electrical leakage",
                "cleaning",
                "drying",
                "SEM",
                "EDS",
                "evidence interpretation",
                "moisture-sensitive leakage",
                "flux entrapment",
                "solder flux residue",
                "copper",
                "immersion silver",
                "solder mask",
                "electrical testing",
                "optical microscopy",
                "cross-sectioning",
                "ion chromatography"
            ],
            "audience": [
                "failure-analysis engineers",
                "manufacturing engineers",
                "process engineers",
                "reliability engineers",
                "quality engineers",
                "technical managers"
            ],
            "availability": [
                "free_public_download"
            ],
            "price": null,
            "purchase_url": "https://www.semlab.com/assets/sample-report/solder-flux-associated-failures-sample-report.pdf",
            "page_url": "https://www.semlab.com/sample-failure-analysis-report.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0001",
            "slug": "bga-assembly-verification",
            "title": "BGA Assembly Verification",
            "abstract": "This paper covers BGA assembly verification using microsection and SEM analysis. The source page makes the practical purpose clear: the work is used to optimize assembly processes early in the product development cycle and help prevent failure during production. That makes this paper more than a narrow inspection note. It is a process-validation reference for engineers who need to verify that BGA assembly quality is adequate before product release or volume manufacturing.",
            "failure_modes": [
                "solder-joint quality defects"
            ],
            "technologies": [
                "BGA assembly verification",
                "microsection analysis",
                "SEM analysis",
                "assembly validation",
                "process optimization",
                "solder-joint quality"
            ],
            "materials": [
                "solder"
            ],
            "methods": [
                "microsectioning",
                "SEM"
            ],
            "keywords": [
                "BGA assembly verification",
                "microsection analysis",
                "SEM analysis",
                "assembly validation",
                "process optimization",
                "solder-joint quality",
                "solder-joint quality defects",
                "solder",
                "microsectioning",
                "SEM"
            ],
            "audience": [
                "manufacturing engineers",
                "process engineers",
                "quality engineers",
                "product engineers",
                "reliability engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "25.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/bga-assembly-verification.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0003",
            "slug": "failure-analysis-of-aluminum-electrolytic-capacitors",
            "title": "Failure Analysis of Aluminum Electrolytic Capacitors",
            "abstract": "This paper is described on the source page as a 21-page booklet summarizing the author's experience performing failure analysis on aluminum electrolytic capacitors over a fifteen-year period. It covers failure mechanisms seen in these capacitors and the failure-analysis techniques used to identify the failures. The source page also notes that the document includes figures, equations, and graphs. That makes it a deeper stand-alone technical reference rather than a short overview paper.",
            "failure_modes": [
                "capacitor failure"
            ],
            "technologies": [
                "failure analysis of aluminum electrolytic capacitors",
                "capacitor failure mechanisms",
                "analytical techniques",
                "figures",
                "equations",
                "graphs",
                "component failure analysis"
            ],
            "materials": [
                "aluminum electrolyte systems"
            ],
            "methods": [
                "component failure analysis"
            ],
            "keywords": [
                "failure analysis of aluminum electrolytic capacitors",
                "capacitor failure mechanisms",
                "analytical techniques",
                "figures",
                "equations",
                "graphs",
                "component failure analysis",
                "capacitor failure",
                "aluminum electrolyte systems"
            ],
            "audience": [
                "component engineers",
                "failure-analysis engineers",
                "reliability engineers",
                "manufacturing engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "105.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/failure-analysis-of-aluminum-electrolytic-capacitors.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0005",
            "slug": "failure-analysis-of-leds",
            "title": "Failure Analysis of LEDs",
            "abstract": "This paper covers recurring LED failure modes and the practical failure-analysis approach used to evaluate them. The source page describes intermittent or no-light symptoms, and it notes that LED failures often involve de-bonding of the lens material from the cup or die surface due to thermal-expansion mismatch and thermal stress. The paper also appears to summarize other failure modes seen in SEM Lab LED work, including die attach failure, die cracking, wedge bond failure, and ball bond failure. The overall pattern is that many of these failures are induced by mechanical or thermo-mechanical stresses.",
            "failure_modes": [
                "die cracking",
                "die-attach failure",
                "wire-bond failure",
                "lens debonding"
            ],
            "technologies": [
                "LED failure analysis",
                "die attach failure",
                "die cracking",
                "wedge bond failure",
                "ball bond failure",
                "thermo-mechanical stress",
                "lens de-bonding"
            ],
            "materials": [
                "semiconductor die",
                "bond wire",
                "lens polymer"
            ],
            "methods": [
                "SEM",
                "component examination"
            ],
            "keywords": [
                "LED failure analysis",
                "die attach failure",
                "die cracking",
                "wedge bond failure",
                "ball bond failure",
                "thermo-mechanical stress",
                "lens de-bonding",
                "die-attach failure",
                "wire-bond failure",
                "lens debonding",
                "semiconductor die",
                "bond wire",
                "lens polymer",
                "SEM",
                "component examination"
            ],
            "audience": [
                "electronics failure-analysis engineers",
                "reliability engineers",
                "component engineers",
                "manufacturing engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "20.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/failure-analysis-of-leds.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        }
    ]
}