{ "query": "Solder Joint Analysis", "total": 20, "limit": 10, "catalog_generated_at": "2026-09-17T18:09:54Z", "results": [ { "report_id": "SEM-EVIDENCE-0018", "slug": "solder-joint-analysis", "title": "Solder Joint Analysis", "abstract": "This paper covers techniques for analyzing solder joints and highlights SEM Lab capabilities in solder-joint evaluation and failure analysis. The source page specifically identifies metallurgical cross-sectioning, SEM/EDS analysis, failure analysis, and computational metallurgical analysis as part of the paper's scope. The page also states that the analysis results are essential for credible design, process, and product failure analysis. That positions the paper as a broad solder-joint reference rather than a narrow mechanism note.", "failure_modes": [ "solder-joint failure", "metallurgical defects" ], "technologies": [ "solder joint analysis", "metallurgical cross-sectioning", "SEM/EDS", "solder-joint failure analysis", "computational metallurgical analysis", "design and process evaluation" ], "materials": [ "solder", "intermetallic compounds" ], "methods": [ "metallurgical cross-sectioning", "SEM", "EDS", "computational metallurgical analysis" ], "keywords": [ "solder joint analysis", "metallurgical cross-sectioning", "SEM/EDS", "solder-joint failure analysis", "computational metallurgical analysis", "design and process evaluation", "solder-joint failure", "metallurgical defects", "solder", "intermetallic compounds", "SEM", "EDS" ], "audience": [ "failure-analysis engineers", "manufacturing engineers", "materials engineers", "reliability engineers", "product engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "55.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/solder-joint-analysis.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0011", "slug": "gold-embrittlement-of-solder-joints", "title": "Gold Embrittlement of Solder Joints", "abstract": "This expanded paper draws on solder-joint investigations performed over more than 20 years. It examines eutectic tin-lead, SN62, Sn-Ag, and SAC305 joints using BSE SEM imaging, EDS, image analysis, fracture-surface examination, plating cross-sections, and mass-balance calculations. The paper treats approximately 3 wt% gold as a useful screening value while showing why average gold concentration alone can be misleading. Case evidence includes localized Au-Sn segregation below the calculated joint average, agreement and disagreement between chemistry and image area, Cu- and Ni-bearing reaction products in lead-free systems, an extreme SAC305 transformation, thin die-attach damage during cool-down, anomalous connector plating, thermal-aging effects, and low-gold comparison cases.", "failure_modes": [ "gold embrittlement", "brittle solder-joint fracture" ], "technologies": [ "gold embrittlement of tin-based solder joints", "AuSn4", "AuSn2", "gold inventory", "intermetallic volume fraction", "Sn-Pb", "SN62", "Sn-Ag", "SAC305", "Cu-bearing reaction products", "SEM/EDS", "BSE imaging", "image analysis", "fracture surfaces", "thermal aging", "plating verification" ], "materials": [ "gold", "solder", "intermetallic compounds" ], "methods": [ "metallographic cross-sectioning", "SEM", "EDS" ], "keywords": [ "gold embrittlement of tin-based solder joints", "AuSn4", "AuSn2", "gold inventory", "intermetallic volume fraction", "Sn-Pb", "SN62", "Sn-Ag", "SAC305", "Cu-bearing reaction products", "SEM/EDS", "BSE imaging", "image analysis", "fracture surfaces", "thermal aging", "plating verification", "gold embrittlement", "brittle solder-joint fracture", "gold", "solder", "intermetallic compounds", "metallographic cross-sectioning", "SEM", "EDS" ], "audience": [ "failure-analysis engineers", "materials engineers", "reliability engineers", "soldering-process engineers", "electronics-packaging engineers", "manufacturing engineers", "quality engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "150.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/gold-embrittlement-of-solder-joints.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0014", "slug": "intermetallics-in-solder-joints", "title": "Intermetallics in Solder Joints", "abstract": "This paper explains why intermetallic compounds in solder joints are not a simple \"good\" or \"bad\" issue. It covers the basic role of intermetallic layers, why excessive intermetallic formation can damage joint performance, and why the absence of expected interfacial intermetallics can indicate a process or material problem. The paper discusses several intermetallic systems that are important in electronics work, including Cu6Sn5, Cu3Sn, Ni3Sn4, AuSn4, and Ag3Sn. It also includes discussion of gold embrittlement, volume-fraction effects, and ternary intermetallic phases that can contribute to brittle interfacial behavior.", "failure_modes": [ "excessive intermetallic growth", "brittle interfacial fracture" ], "technologies": [ "solder-joint intermetallic compounds", "gold embrittlement", "Cu-Sn intermetallics", "Ni-Sn intermetallics", "Ag-Sn intermetallics", "interfacial solder-joint microstructure" ], "materials": [ "Cu6Sn5", "Cu3Sn", "Ni3Sn4", "AuSn4", "Ag3Sn" ], "methods": [ "metallographic cross-sectioning", "SEM", "EDS" ], "keywords": [ "solder-joint intermetallic compounds", "gold embrittlement", "Cu-Sn intermetallics", "Ni-Sn intermetallics", "Ag-Sn intermetallics", "interfacial solder-joint microstructure", "excessive intermetallic growth", "brittle interfacial fracture", "Cu6Sn5", "Cu3Sn", "Ni3Sn4", "AuSn4", "Ag3Sn", "metallographic cross-sectioning", "SEM", "EDS" ], "audience": [ "electronics failure-analysis engineers", "manufacturing engineers", "materials engineers", "reliability engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "45.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/intermetallics-in-solder-joints.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0004", "slug": "failure-analysis-of-bgas", "title": "Failure Analysis of BGAs", "abstract": "This paper covers practical approaches for failure analysis of Ball Grid Array devices. The source page describes BGA analysis as difficult because of the high I/O count and packaging density, and it positions the paper as a discussion of several BGA failure modes and analysis approaches that can be performed with a limited number of analytical tools. The paper also appears to distinguish between cases that can be addressed with limited tools such as a DMM, microsectioning, and SEM/EDS, and cases where more advanced work is needed to identify the failure cause.", "failure_modes": [ "BGA open circuit", "BGA short circuit", "solder-joint fracture" ], "technologies": [ "BGA failure analysis", "BGA solder-joint failure modes", "limited-tools analysis", "microsectioning", "SEM/EDS", "electrical screening" ], "materials": [ "solder" ], "methods": [ "electrical screening", "microsectioning", "SEM", "EDS" ], "keywords": [ "BGA failure analysis", "BGA solder-joint failure modes", "limited-tools analysis", "microsectioning", "SEM/EDS", "electrical screening", "BGA open circuit", "BGA short circuit", "solder-joint fracture", "solder", "SEM", "EDS" ], "audience": [ "electronics failure-analysis engineers", "reliability engineers", "manufacturing engineers", "component engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "45.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/failure-analysis-of-bgas.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0017", "slug": "solder-flux-residue-part-2", "title": "Solder Flux Residue - Part 2", "abstract": "This paper extends the solder-flux-residue topic by examining how to interpret EDS data when the electron beam can penetrate thin residue layers and include contribution from the solder mask underneath. The source page specifically frames the paper around removing that solder-mask contribution from the analysis. That makes Part 2 a useful companion to Part 1 rather than a repeat. It is focused more narrowly on how to interpret the data correctly when residue is present on a PCBA surface.", "failure_modes": [ "contamination", "analytical interference" ], "technologies": [ "solder flux residue", "EDS interpretation", "solder-mask contribution", "contamination analysis", "corrosion", "leakage analysis" ], "materials": [ "solder flux residue", "solder mask" ], "methods": [ "SEM", "EDS", "background correction" ], "keywords": [ "solder flux residue", "EDS interpretation", "solder-mask contribution", "contamination analysis", "corrosion", "leakage analysis", "contamination", "analytical interference", "solder mask", "SEM", "EDS", "background correction" ], "audience": [ "failure-analysis engineers", "manufacturing engineers", "quality engineers", "materials engineers", "reliability engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "15.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/solder-flux-residue-part-2.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0006", "slug": "failure-analysis-of-pcbas", "title": "Failure Analysis of PCBAs", "abstract": "This paper covers practical failure-analysis approaches for printed circuit board assemblies. The source page outlines a general workflow that includes documentation review, microscope examination, electrical isolation or verification of the failure, cross-sectioning for PWB-related failures, decapsulation or cross-sectioning for component-related failures, and SEM/EDS work to document the failure site and resolve root cause. The page also includes practical \"dos and don'ts\" intended to improve the timeliness and cost effectiveness of PCBA failure analysis. That makes the paper useful not only as a mechanism reference, but also as a guide to handling, documentation, and pre-analysis discipline.", "failure_modes": [ "contamination", "corrosion", "assembly failure" ], "technologies": [ "PCBA failure analysis", "documentation review", "stereomicroscope examination", "electrical verification", "cross-sectioning", "decapsulation", "contamination", "corrosion", "SEM/EDS", "failure-analysis workflow" ], "materials": [ "printed circuit board assemblies", "solder" ], "methods": [ "stereomicroscopy", "electrical verification", "cross-sectioning", "SEM", "EDS" ], "keywords": [ "PCBA failure analysis", "documentation review", "stereomicroscope examination", "electrical verification", "cross-sectioning", "decapsulation", "contamination", "corrosion", "SEM/EDS", "failure-analysis workflow", "assembly failure", "printed circuit board assemblies", "solder", "stereomicroscopy", "SEM", "EDS" ], "audience": [ "electronics failure-analysis engineers", "reliability engineers", "manufacturing engineers", "quality engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "25.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/failure-analysis-of-pcbas.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0021", "slug": "physical-composition-inorganic-fillers-solder-mask", "title": "Physical Composition of Inorganic Fillers in Printed Circuit Solder Mask", "abstract": "This paper converts archived SEM/EDS elemental measurements into estimated physical phase fractions for printed-circuit solder mask. The clean/reference cohort indicates approximately 10-11 vol% total inorganic filler in the modeled mask, with barium sulfate as the principal fitted filler and silica as a smaller but persistent secondary constituent. The paper explains the constrained-regression, stoichiometric, molar-mass, and density basis used to move from ZAF-corrected atomic percentages to mole, weight, and volume fractions. It also separates clean/reference acquisitions from residue-on-mask spectra and states the limits of localized SEM/EDS measurements, the binder surrogate, phase identification, and the small number of independent cases.", "failure_modes": [ "solder-mask formulation variation", "solder-mask cracking", "adhesion loss" ], "technologies": [ "physical composition of inorganic fillers in printed circuit solder mask", "solder-mask formulation", "barium sulfate filler", "silica filler", "filler volume fraction", "SEM/EDS interpretation", "constrained regression", "materials engineering", "process comparison" ], "materials": [ "solder mask", "barium sulfate", "silica", "epoxy binder" ], "methods": [ "SEM", "EDS", "nonnegative constrained regression", "stoichiometric mass-balance analysis" ], "keywords": [ "physical composition of inorganic fillers in printed circuit solder mask", "solder-mask formulation", "barium sulfate filler", "silica filler", "filler volume fraction", "SEM/EDS interpretation", "constrained regression", "materials engineering", "process comparison", "solder-mask formulation variation", "solder-mask cracking", "adhesion loss", "solder mask", "barium sulfate", "silica", "epoxy binder", "SEM", "EDS", "nonnegative constrained regression", "stoichiometric mass-balance analysis" ], "audience": [ "printed-circuit-board engineers", "materials engineers", "manufacturing engineers", "process engineers", "failure-analysis engineers", "reliability engineers", "quality engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "30.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/physical-composition-inorganic-fillers-solder-mask.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-09-17" }, { "report_id": "SEM-EVIDENCE-0020", "slug": "solder-mask-defects-electrical-failure", "title": "Solder Mask Defects and Their Role in Electrical Failure", "abstract": "This case-based paper explains when solder-mask defects contribute directly to electrical failure and when mask condition is only one factor in a mixed-cause investigation. It connects incomplete coverage, aperture misregistration, incomplete via tenting, mechanical damage, contamination, and below-mask corrosion with physical evidence from eight anonymized SEM Lab cases. The paper emphasizes that mask thickness, composition, cracking, blistering, or EDS detection of mask constituents does not independently establish root cause. Defensible conclusions must also agree with the electrical path, board geometry, conductor clearance, contamination, moisture, voltage stress, process history, and comparison samples.", "failure_modes": [ "hi-pot breakdown", "corrosion", "open circuit", "electrical leakage", "solder-joint geometry distortion" ], "technologies": [ "solder mask defects and electrical failure", "incomplete solder-mask coverage", "hi-pot breakdown", "aperture misregistration", "BGA solder-joint geometry", "incomplete via tenting", "corrosion", "ionic contamination", "electrical leakage", "conductor clearance", "SEM/EDS interpretation" ], "materials": [ "solder mask", "copper conductors", "printed wiring boards", "flux residue" ], "methods": [ "optical microscopy", "SEM", "EDS", "cross-sectioning", "electrical failure localization" ], "keywords": [ "solder mask defects and electrical failure", "incomplete solder-mask coverage", "hi-pot breakdown", "aperture misregistration", "BGA solder-joint geometry", "incomplete via tenting", "corrosion", "ionic contamination", "electrical leakage", "conductor clearance", "SEM/EDS interpretation", "open circuit", "solder-joint geometry distortion", "solder mask", "copper conductors", "printed wiring boards", "flux residue", "optical microscopy", "SEM", "EDS", "cross-sectioning", "electrical failure localization" ], "audience": [ "failure-analysis engineers", "reliability engineers", "printed-circuit-board engineers", "manufacturing engineers", "process engineers", "quality engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "60.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/solder-mask-defects-electrical-failure.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-03" }, { "report_id": "SEM-EVIDENCE-0019", "slug": "solder-flux-associated-failures-sample-report", "title": "Solder-Flux-Associated Failures in Electronic Assemblies", "abstract": "This free 10-page sample report demonstrates how SEM Lab connects electrical behavior, failure-site location, SEM imaging, EDS chemistry, process history, and evidence limits in a clear technical deliverable. Six anonymized cases show how retained solder-flux residue can contribute to moisture-sensitive leakage, corrosion, electrochemical migration, and combined manufacturing defects. The report also provides a failure-analysis sequence and practical process controls. It is published as a composite marketing example so prospective clients can evaluate the structure, evidence traceability, and calibrated conclusion language used in SEM Lab technical reporting.", "failure_modes": [ "moisture-sensitive leakage", "corrosion", "electrochemical migration", "flux entrapment" ], "technologies": [ "solder-flux-associated failures in electronic assemblies", "flux residue", "corrosion", "electrochemical migration", "electrical leakage", "cleaning", "drying", "SEM", "EDS", "evidence interpretation" ], "materials": [ "solder flux residue", "copper", "immersion silver", "solder mask" ], "methods": [ "electrical testing", "optical microscopy", "SEM", "EDS", "cross-sectioning", "ion chromatography" ], "keywords": [ "solder-flux-associated failures in electronic assemblies", "flux residue", "corrosion", "electrochemical migration", "electrical leakage", "cleaning", "drying", "SEM", "EDS", "evidence interpretation", "moisture-sensitive leakage", "flux entrapment", "solder flux residue", "copper", "immersion silver", "solder mask", "electrical testing", "optical microscopy", "cross-sectioning", "ion chromatography" ], "audience": [ "failure-analysis engineers", "manufacturing engineers", "process engineers", "reliability engineers", "quality engineers", "technical managers" ], "availability": [ "free_public_download" ], "price": null, "purchase_url": "https://www.semlab.com/assets/sample-report/solder-flux-associated-failures-sample-report.pdf", "page_url": "https://www.semlab.com/sample-failure-analysis-report.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0001", "slug": "bga-assembly-verification", "title": "BGA Assembly Verification", "abstract": "This paper covers BGA assembly verification using microsection and SEM analysis. The source page makes the practical purpose clear: the work is used to optimize assembly processes early in the product development cycle and help prevent failure during production. That makes this paper more than a narrow inspection note. It is a process-validation reference for engineers who need to verify that BGA assembly quality is adequate before product release or volume manufacturing.", "failure_modes": [ "solder-joint quality defects" ], "technologies": [ "BGA assembly verification", "microsection analysis", "SEM analysis", "assembly validation", "process optimization", "solder-joint quality" ], "materials": [ "solder" ], "methods": [ "microsectioning", "SEM" ], "keywords": [ "BGA assembly verification", "microsection analysis", "SEM analysis", "assembly validation", "process optimization", "solder-joint quality", "solder-joint quality defects", "solder", "microsectioning", "SEM" ], "audience": [ "manufacturing engineers", "process engineers", "quality engineers", "product engineers", "reliability engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "25.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/bga-assembly-verification.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" } ] }