{ "query": "Intermetallics in Solder Joints", "total": 18, "limit": 10, "catalog_generated_at": "2026-08-01T15:46:10Z", "results": [ { "report_id": "SEM-EVIDENCE-0014", "slug": "intermetallics-in-solder-joints", "title": "Intermetallics in Solder Joints", "abstract": "This paper explains why intermetallic compounds in solder joints are not a simple \"good\" or \"bad\" issue. It covers the basic role of intermetallic layers, why excessive intermetallic formation can damage joint performance, and why the absence of expected interfacial intermetallics can indicate a process or material problem. The paper discusses several intermetallic systems that are important in electronics work, including Cu6Sn5, Cu3Sn, Ni3Sn4, AuSn4, and Ag3Sn. It also includes discussion of gold embrittlement, volume-fraction effects, and ternary intermetallic phases that can contribute to brittle interfacial behavior.", "failure_modes": [ "excessive intermetallic growth", "brittle interfacial fracture" ], "technologies": [ "solder-joint intermetallic compounds", "gold embrittlement", "Cu-Sn intermetallics", "Ni-Sn intermetallics", "Ag-Sn intermetallics", "interfacial solder-joint microstructure" ], "materials": [ "Cu6Sn5", "Cu3Sn", "Ni3Sn4", "AuSn4", "Ag3Sn" ], "methods": [ "metallographic cross-sectioning", "SEM", "EDS" ], "keywords": [ "solder-joint intermetallic compounds", "gold embrittlement", "Cu-Sn intermetallics", "Ni-Sn intermetallics", "Ag-Sn intermetallics", "interfacial solder-joint microstructure", "excessive intermetallic growth", "brittle interfacial fracture", "Cu6Sn5", "Cu3Sn", "Ni3Sn4", "AuSn4", "Ag3Sn", "metallographic cross-sectioning", "SEM", "EDS" ], "audience": [ "electronics failure-analysis engineers", "manufacturing engineers", "materials engineers", "reliability engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "45.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/intermetallics-in-solder-joints.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0011", "slug": "gold-embrittlement-of-solder-joints", "title": "Gold Embrittlement of Solder Joints", "abstract": "This paper covers gold embrittlement of solder joints as a recurring and still significant electronics failure-analysis problem. The source page notes that gold-embrittlement-related failures represent a significant portion of the work analyzed at SEM Lab and states that the paper provides a detailed account of material and process parameters that can lead to this condition in electronic assemblies. The paper appears to be positioned both as a practical failure-analysis reference and as a prevention-oriented document for understanding how solder-joint design and process choices can avoid embrittlement problems.", "failure_modes": [ "gold embrittlement", "brittle solder-joint fracture" ], "technologies": [ "gold embrittlement in solder joints", "solder-joint failure", "intermetallic compounds", "process parameters", "material parameters", "electronic assemblies" ], "materials": [ "gold", "solder", "intermetallic compounds" ], "methods": [ "metallographic cross-sectioning", "SEM", "EDS" ], "keywords": [ "gold embrittlement in solder joints", "solder-joint failure", "intermetallic compounds", "process parameters", "material parameters", "electronic assemblies", "gold embrittlement", "brittle solder-joint fracture", "gold", "solder", "metallographic cross-sectioning", "SEM", "EDS" ], "audience": [ "electronics failure-analysis engineers", "manufacturing engineers", "materials engineers", "reliability engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "60.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/gold-embrittlement-of-solder-joints.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0018", "slug": "solder-joint-analysis", "title": "Solder Joint Analysis", "abstract": "This paper covers techniques for analyzing solder joints and highlights SEM Lab capabilities in solder-joint evaluation and failure analysis. The source page specifically identifies metallurgical cross-sectioning, SEM/EDS analysis, failure analysis, and computational metallurgical analysis as part of the paper's scope. The page also states that the analysis results are essential for credible design, process, and product failure analysis. That positions the paper as a broad solder-joint reference rather than a narrow mechanism note.", "failure_modes": [ "solder-joint failure", "metallurgical defects" ], "technologies": [ "solder joint analysis", "metallurgical cross-sectioning", "SEM/EDS", "solder-joint failure analysis", "computational metallurgical analysis", "design and process evaluation" ], "materials": [ "solder", "intermetallic compounds" ], "methods": [ "metallurgical cross-sectioning", "SEM", "EDS", "computational metallurgical analysis" ], "keywords": [ "solder joint analysis", "metallurgical cross-sectioning", "SEM/EDS", "solder-joint failure analysis", "computational metallurgical analysis", "design and process evaluation", "solder-joint failure", "metallurgical defects", "solder", "intermetallic compounds", "SEM", "EDS" ], "audience": [ "failure-analysis engineers", "manufacturing engineers", "materials engineers", "reliability engineers", "product engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "55.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/solder-joint-analysis.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0019", "slug": "solder-flux-associated-failures-sample-report", "title": "Solder-Flux-Associated Failures in Electronic Assemblies", "abstract": "This free 10-page sample report demonstrates how SEM Lab connects electrical behavior, failure-site location, SEM imaging, EDS chemistry, process history, and evidence limits in a clear technical deliverable. Six anonymized cases show how retained solder-flux residue can contribute to moisture-sensitive leakage, corrosion, electrochemical migration, and combined manufacturing defects. The report also provides a failure-analysis sequence and practical process controls. It is published as a composite marketing example so prospective clients can evaluate the structure, evidence traceability, and calibrated conclusion language used in SEM Lab technical reporting.", "failure_modes": [ "moisture-sensitive leakage", "corrosion", "electrochemical migration", "flux entrapment" ], "technologies": [ "solder-flux-associated failures in electronic assemblies", "flux residue", "corrosion", "electrochemical migration", "electrical leakage", "cleaning", "drying", "SEM", "EDS", "evidence interpretation" ], "materials": [ "solder flux residue", "copper", "immersion silver", "solder mask" ], "methods": [ "electrical testing", "optical microscopy", "SEM", "EDS", "cross-sectioning", "ion chromatography" ], "keywords": [ "solder-flux-associated failures in electronic assemblies", "flux residue", "corrosion", "electrochemical migration", "electrical leakage", "cleaning", "drying", "SEM", "EDS", "evidence interpretation", "moisture-sensitive leakage", "flux entrapment", "solder flux residue", "copper", "immersion silver", "solder mask", "electrical testing", "optical microscopy", "cross-sectioning", "ion chromatography" ], "audience": [ "failure-analysis engineers", "manufacturing engineers", "process engineers", "reliability engineers", "quality engineers", "technical managers" ], "availability": [ "free_public_download" ], "price": null, "purchase_url": "https://www.semlab.com/assets/sample-report/solder-flux-associated-failures-sample-report.pdf", "page_url": "https://www.semlab.com/sample-failure-analysis-report.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0002", "slug": "diffusion-barrier-plating-in-electronics", "title": "Diffusion Barrier Plating in Electronics", "abstract": "This paper covers the use of diffusion barriers in electronics manufacturing and the practical reasons they matter. The source page notes that diffusion barriers have been used for decades, but that SEM Lab still sees cases where barrier layers are omitted when they likely should have been used. The page positions the paper as a series of examples illustrating diffusion-barrier use in electronics manufacturing and links the issue directly to soldering-process quality and solder-joint reliability. That makes the paper useful both as a microstructural reference and as a process-selection reference.", "failure_modes": [ "barrier-layer omission", "interfacial degradation" ], "technologies": [ "diffusion barrier plating in electronics", "plating systems", "solder-joint reliability", "microstructural evaluation", "barrier layers", "manufacturing process quality" ], "materials": [ "diffusion-barrier plating", "solder" ], "methods": [ "SEM", "metallographic cross-sectioning" ], "keywords": [ "diffusion barrier plating in electronics", "plating systems", "solder-joint reliability", "microstructural evaluation", "barrier layers", "manufacturing process quality", "barrier-layer omission", "interfacial degradation", "diffusion-barrier plating", "solder", "SEM", "metallographic cross-sectioning" ], "audience": [ "electronics failure-analysis engineers", "manufacturing engineers", "materials engineers", "plating engineers", "reliability engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "30.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/diffusion-barrier-plating-in-electronics.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0012", "slug": "hasl-finish-on-pwb", "title": "HASL Finish on PWBs", "abstract": "This paper covers HASL finish on PWBs and fits the practical process side of the SEM Lab paper catalog. It belongs with the papers that help engineers evaluate assembly-related materials and process conditions before those conditions turn into field or manufacturing failures. The paper should be positioned as a useful reference for engineers dealing with solderability, surface-finish quality, and the effect of board finish condition on assembly results and longer-term reliability.", "failure_modes": [ "solderability degradation", "surface-finish defects" ], "technologies": [ "HASL finish on printed wiring boards", "solderability", "surface finish evaluation", "assembly quality", "process control", "PWB reliability" ], "materials": [ "HASL", "solder", "printed wiring board" ], "methods": [ "surface-finish evaluation", "solderability assessment" ], "keywords": [ "HASL finish on printed wiring boards", "solderability", "surface finish evaluation", "assembly quality", "process control", "PWB reliability", "solderability degradation", "surface-finish defects", "HASL", "solder", "printed wiring board", "surface-finish evaluation", "solderability assessment" ], "audience": [ "manufacturing engineers", "process engineers", "materials engineers", "quality engineers", "reliability engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "35.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/hasl-finish-on-pwb.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0013", "slug": "images-of-failures-in-microelectronics-packaging", "title": "Images of Failures in Microelectronics Packaging", "abstract": "This paper is positioned as a collection of failures seen at SEM Lab in microelectronics packaging. The source page states that it includes examples such as gold embrittlement, mechanical damage, solder-joint failure, black pad syndrome, and various other failure mechanisms. That makes the paper useful as a broad visual and mechanism-oriented reference rather than a narrowly focused single-topic treatment. It appears to function as a consolidated packaging-failure example set.", "failure_modes": [ "gold embrittlement", "mechanical damage", "black pad", "solder-joint failure" ], "technologies": [ "failures in microelectronics packaging", "gold embrittlement", "mechanical damage", "solder-joint failure", "black pad syndrome", "packaging failure mechanisms", "image examples" ], "materials": [ "microelectronics packaging", "solder" ], "methods": [ "SEM", "visual comparison" ], "keywords": [ "failures in microelectronics packaging", "gold embrittlement", "mechanical damage", "solder-joint failure", "black pad syndrome", "packaging failure mechanisms", "image examples", "black pad", "microelectronics packaging", "solder", "SEM", "visual comparison" ], "audience": [ "electronics failure-analysis engineers", "packaging engineers", "reliability engineers", "manufacturing engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "320.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/images-of-failures-in-microelectronics-packaging.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0016", "slug": "solder-flux-residue-part-1", "title": "Solder Flux Residue - Part 1", "abstract": "This paper covers solder flux residue left on printed circuit board assemblies and the problems it can cause, including corrosion, electro-chemical migration, electrical leakage, and short-circuit faults. The source page also makes clear that the paper investigates what conclusions can be drawn from EDS data for solder flux residue. That gives the paper practical value beyond simple contamination awareness. It helps connect residue, analytical evidence, and engineering interpretation in cases where the contamination mechanism matters.", "failure_modes": [ "corrosion", "electrochemical migration", "electrical leakage", "short circuit" ], "technologies": [ "solder flux residue", "corrosion", "electro-chemical migration", "electrical leakage", "short-circuit faults", "SEM/EDS interpretation" ], "materials": [ "solder flux residue", "printed circuit board assembly" ], "methods": [ "SEM", "EDS" ], "keywords": [ "solder flux residue", "corrosion", "electro-chemical migration", "electrical leakage", "short-circuit faults", "SEM/EDS interpretation", "electrochemical migration", "short circuit", "printed circuit board assembly", "SEM", "EDS" ], "audience": [ "failure-analysis engineers", "manufacturing engineers", "quality engineers", "materials engineers", "reliability engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "15.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/solder-flux-residue-part-1.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0017", "slug": "solder-flux-residue-part-2", "title": "Solder Flux Residue - Part 2", "abstract": "This paper extends the solder-flux-residue topic by examining how to interpret EDS data when the electron beam can penetrate thin residue layers and include contribution from the solder mask underneath. The source page specifically frames the paper around removing that solder-mask contribution from the analysis. That makes Part 2 a useful companion to Part 1 rather than a repeat. It is focused more narrowly on how to interpret the data correctly when residue is present on a PCBA surface.", "failure_modes": [ "contamination", "analytical interference" ], "technologies": [ "solder flux residue", "EDS interpretation", "solder-mask contribution", "contamination analysis", "corrosion", "leakage analysis" ], "materials": [ "solder flux residue", "solder mask" ], "methods": [ "SEM", "EDS", "background correction" ], "keywords": [ "solder flux residue", "EDS interpretation", "solder-mask contribution", "contamination analysis", "corrosion", "leakage analysis", "contamination", "analytical interference", "solder mask", "SEM", "EDS", "background correction" ], "audience": [ "failure-analysis engineers", "manufacturing engineers", "quality engineers", "materials engineers", "reliability engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "15.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/solder-flux-residue-part-2.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0003", "slug": "failure-analysis-of-aluminum-electrolytic-capacitors", "title": "Failure Analysis of Aluminum Electrolytic Capacitors", "abstract": "This paper is described on the source page as a 21-page booklet summarizing the author's experience performing failure analysis on aluminum electrolytic capacitors over a fifteen-year period. It covers failure mechanisms seen in these capacitors and the failure-analysis techniques used to identify the failures. The source page also notes that the document includes figures, equations, and graphs. That makes it a deeper stand-alone technical reference rather than a short overview paper.", "failure_modes": [ "capacitor failure" ], "technologies": [ "failure analysis of aluminum electrolytic capacitors", "capacitor failure mechanisms", "analytical techniques", "figures", "equations", "graphs", "component failure analysis" ], "materials": [ "aluminum electrolyte systems" ], "methods": [ "component failure analysis" ], "keywords": [ "failure analysis of aluminum electrolytic capacitors", "capacitor failure mechanisms", "analytical techniques", "figures", "equations", "graphs", "component failure analysis", "capacitor failure", "aluminum electrolyte systems" ], "audience": [ "component engineers", "failure-analysis engineers", "reliability engineers", "manufacturing engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "105.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/failure-analysis-of-aluminum-electrolytic-capacitors.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" } ] }