{ "query": "Images of Failures in Microelectronics Packaging", "total": 20, "limit": 10, "catalog_generated_at": "2026-09-17T18:09:54Z", "results": [ { "report_id": "SEM-EVIDENCE-0013", "slug": "images-of-failures-in-microelectronics-packaging", "title": "Images of Failures in Microelectronics Packaging", "abstract": "This paper is positioned as a collection of failures seen at SEM Lab in microelectronics packaging. The source page states that it includes examples such as gold embrittlement, mechanical damage, solder-joint failure, black pad syndrome, and various other failure mechanisms. That makes the paper useful as a broad visual and mechanism-oriented reference rather than a narrowly focused single-topic treatment. It appears to function as a consolidated packaging-failure example set.", "failure_modes": [ "gold embrittlement", "mechanical damage", "black pad", "solder-joint failure" ], "technologies": [ "failures in microelectronics packaging", "gold embrittlement", "mechanical damage", "solder-joint failure", "black pad syndrome", "packaging failure mechanisms", "image examples" ], "materials": [ "microelectronics packaging", "solder" ], "methods": [ "SEM", "visual comparison" ], "keywords": [ "failures in microelectronics packaging", "gold embrittlement", "mechanical damage", "solder-joint failure", "black pad syndrome", "packaging failure mechanisms", "image examples", "black pad", "microelectronics packaging", "solder", "SEM", "visual comparison" ], "audience": [ "electronics failure-analysis engineers", "packaging engineers", "reliability engineers", "manufacturing engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "320.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/images-of-failures-in-microelectronics-packaging.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0003", "slug": "failure-analysis-of-aluminum-electrolytic-capacitors", "title": "Failure Analysis of Aluminum Electrolytic Capacitors", "abstract": "This paper is described on the source page as a 21-page booklet summarizing the author's experience performing failure analysis on aluminum electrolytic capacitors over a fifteen-year period. It covers failure mechanisms seen in these capacitors and the failure-analysis techniques used to identify the failures. The source page also notes that the document includes figures, equations, and graphs. That makes it a deeper stand-alone technical reference rather than a short overview paper.", "failure_modes": [ "capacitor failure" ], "technologies": [ "failure analysis of aluminum electrolytic capacitors", "capacitor failure mechanisms", "analytical techniques", "figures", "equations", "graphs", "component failure analysis" ], "materials": [ "aluminum electrolyte systems" ], "methods": [ "component failure analysis" ], "keywords": [ "failure analysis of aluminum electrolytic capacitors", "capacitor failure mechanisms", "analytical techniques", "figures", "equations", "graphs", "component failure analysis", "capacitor failure", "aluminum electrolyte systems" ], "audience": [ "component engineers", "failure-analysis engineers", "reliability engineers", "manufacturing engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "105.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/failure-analysis-of-aluminum-electrolytic-capacitors.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0021", "slug": "physical-composition-inorganic-fillers-solder-mask", "title": "Physical Composition of Inorganic Fillers in Printed Circuit Solder Mask", "abstract": "This paper converts archived SEM/EDS elemental measurements into estimated physical phase fractions for printed-circuit solder mask. The clean/reference cohort indicates approximately 10-11 vol% total inorganic filler in the modeled mask, with barium sulfate as the principal fitted filler and silica as a smaller but persistent secondary constituent. The paper explains the constrained-regression, stoichiometric, molar-mass, and density basis used to move from ZAF-corrected atomic percentages to mole, weight, and volume fractions. It also separates clean/reference acquisitions from residue-on-mask spectra and states the limits of localized SEM/EDS measurements, the binder surrogate, phase identification, and the small number of independent cases.", "failure_modes": [ "solder-mask formulation variation", "solder-mask cracking", "adhesion loss" ], "technologies": [ "physical composition of inorganic fillers in printed circuit solder mask", "solder-mask formulation", "barium sulfate filler", "silica filler", "filler volume fraction", "SEM/EDS interpretation", "constrained regression", "materials engineering", "process comparison" ], "materials": [ "solder mask", "barium sulfate", "silica", "epoxy binder" ], "methods": [ "SEM", "EDS", "nonnegative constrained regression", "stoichiometric mass-balance analysis" ], "keywords": [ "physical composition of inorganic fillers in printed circuit solder mask", "solder-mask formulation", "barium sulfate filler", "silica filler", "filler volume fraction", "SEM/EDS interpretation", "constrained regression", "materials engineering", "process comparison", "solder-mask formulation variation", "solder-mask cracking", "adhesion loss", "solder mask", "barium sulfate", "silica", "epoxy binder", "SEM", "EDS", "nonnegative constrained regression", "stoichiometric mass-balance analysis" ], "audience": [ "printed-circuit-board engineers", "materials engineers", "manufacturing engineers", "process engineers", "failure-analysis engineers", "reliability engineers", "quality engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "30.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/physical-composition-inorganic-fillers-solder-mask.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-09-17" }, { "report_id": "SEM-EVIDENCE-0011", "slug": "gold-embrittlement-of-solder-joints", "title": "Gold Embrittlement of Solder Joints", "abstract": "This expanded paper draws on solder-joint investigations performed over more than 20 years. It examines eutectic tin-lead, SN62, Sn-Ag, and SAC305 joints using BSE SEM imaging, EDS, image analysis, fracture-surface examination, plating cross-sections, and mass-balance calculations. The paper treats approximately 3 wt% gold as a useful screening value while showing why average gold concentration alone can be misleading. Case evidence includes localized Au-Sn segregation below the calculated joint average, agreement and disagreement between chemistry and image area, Cu- and Ni-bearing reaction products in lead-free systems, an extreme SAC305 transformation, thin die-attach damage during cool-down, anomalous connector plating, thermal-aging effects, and low-gold comparison cases.", "failure_modes": [ "gold embrittlement", "brittle solder-joint fracture" ], "technologies": [ "gold embrittlement of tin-based solder joints", "AuSn4", "AuSn2", "gold inventory", "intermetallic volume fraction", "Sn-Pb", "SN62", "Sn-Ag", "SAC305", "Cu-bearing reaction products", "SEM/EDS", "BSE imaging", "image analysis", "fracture surfaces", "thermal aging", "plating verification" ], "materials": [ "gold", "solder", "intermetallic compounds" ], "methods": [ "metallographic cross-sectioning", "SEM", "EDS" ], "keywords": [ "gold embrittlement of tin-based solder joints", "AuSn4", "AuSn2", "gold inventory", "intermetallic volume fraction", "Sn-Pb", "SN62", "Sn-Ag", "SAC305", "Cu-bearing reaction products", "SEM/EDS", "BSE imaging", "image analysis", "fracture surfaces", "thermal aging", "plating verification", "gold embrittlement", "brittle solder-joint fracture", "gold", "solder", "intermetallic compounds", "metallographic cross-sectioning", "SEM", "EDS" ], "audience": [ "failure-analysis engineers", "materials engineers", "reliability engineers", "soldering-process engineers", "electronics-packaging engineers", "manufacturing engineers", "quality engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "150.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/gold-embrittlement-of-solder-joints.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0019", "slug": "solder-flux-associated-failures-sample-report", "title": "Solder-Flux-Associated Failures in Electronic Assemblies", "abstract": "This free 10-page sample report demonstrates how SEM Lab connects electrical behavior, failure-site location, SEM imaging, EDS chemistry, process history, and evidence limits in a clear technical deliverable. Six anonymized cases show how retained solder-flux residue can contribute to moisture-sensitive leakage, corrosion, electrochemical migration, and combined manufacturing defects. The report also provides a failure-analysis sequence and practical process controls. It is published as a composite marketing example so prospective clients can evaluate the structure, evidence traceability, and calibrated conclusion language used in SEM Lab technical reporting.", "failure_modes": [ "moisture-sensitive leakage", "corrosion", "electrochemical migration", "flux entrapment" ], "technologies": [ "solder-flux-associated failures in electronic assemblies", "flux residue", "corrosion", "electrochemical migration", "electrical leakage", "cleaning", "drying", "SEM", "EDS", "evidence interpretation" ], "materials": [ "solder flux residue", "copper", "immersion silver", "solder mask" ], "methods": [ "electrical testing", "optical microscopy", "SEM", "EDS", "cross-sectioning", "ion chromatography" ], "keywords": [ "solder-flux-associated failures in electronic assemblies", "flux residue", "corrosion", "electrochemical migration", "electrical leakage", "cleaning", "drying", "SEM", "EDS", "evidence interpretation", "moisture-sensitive leakage", "flux entrapment", "solder flux residue", "copper", "immersion silver", "solder mask", "electrical testing", "optical microscopy", "cross-sectioning", "ion chromatography" ], "audience": [ "failure-analysis engineers", "manufacturing engineers", "process engineers", "reliability engineers", "quality engineers", "technical managers" ], "availability": [ "free_public_download" ], "price": null, "purchase_url": "https://www.semlab.com/assets/sample-report/solder-flux-associated-failures-sample-report.pdf", "page_url": "https://www.semlab.com/sample-failure-analysis-report.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0007", "slug": "failure-analysis-of-pwbs", "title": "Failure Analysis of PWBs", "abstract": "This paper covers common failure modes in PWBs and connects those failures back to board construction quality. The source page specifically identifies Hi-Pot failures, lamination failures, inner layer separation, corrosion failures, PTH copper-plating failures, and conductive anodic filament failures as part of the paper's scope. It also makes a practical point that construction analysis can be used to verify PWB quality before these issues become larger reliability or failure problems. That makes this paper useful both for failure analysis and for front-end quality verification.", "failure_modes": [ "conductive anodic filament formation", "lamination failure", "inner-layer separation", "plated-through-hole failure", "corrosion" ], "technologies": [ "printed wiring board failure analysis", "construction analysis", "PTH copper thickness", "CAF", "lamination failures", "inner layer separation", "corrosion failures", "drilled-hole quality" ], "materials": [ "copper plating", "laminate" ], "methods": [ "construction analysis", "cross-sectioning" ], "keywords": [ "printed wiring board failure analysis", "construction analysis", "PTH copper thickness", "CAF", "lamination failures", "inner layer separation", "corrosion failures", "drilled-hole quality", "conductive anodic filament formation", "lamination failure", "inner-layer separation", "plated-through-hole failure", "corrosion", "copper plating", "laminate", "cross-sectioning" ], "audience": [ "manufacturing engineers", "quality engineers", "reliability engineers", "failure-analysis engineers", "board-fabrication engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "50.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/failure-analysis-of-pwbs.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0004", "slug": "failure-analysis-of-bgas", "title": "Failure Analysis of BGAs", "abstract": "This paper covers practical approaches for failure analysis of Ball Grid Array devices. The source page describes BGA analysis as difficult because of the high I/O count and packaging density, and it positions the paper as a discussion of several BGA failure modes and analysis approaches that can be performed with a limited number of analytical tools. The paper also appears to distinguish between cases that can be addressed with limited tools such as a DMM, microsectioning, and SEM/EDS, and cases where more advanced work is needed to identify the failure cause.", "failure_modes": [ "BGA open circuit", "BGA short circuit", "solder-joint fracture" ], "technologies": [ "BGA failure analysis", "BGA solder-joint failure modes", "limited-tools analysis", "microsectioning", "SEM/EDS", "electrical screening" ], "materials": [ "solder" ], "methods": [ "electrical screening", "microsectioning", "SEM", "EDS" ], "keywords": [ "BGA failure analysis", "BGA solder-joint failure modes", "limited-tools analysis", "microsectioning", "SEM/EDS", "electrical screening", "BGA open circuit", "BGA short circuit", "solder-joint fracture", "solder", "SEM", "EDS" ], "audience": [ "electronics failure-analysis engineers", "reliability engineers", "manufacturing engineers", "component engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "45.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/failure-analysis-of-bgas.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0005", "slug": "failure-analysis-of-leds", "title": "Failure Analysis of LEDs", "abstract": "This paper covers recurring LED failure modes and the practical failure-analysis approach used to evaluate them. The source page describes intermittent or no-light symptoms, and it notes that LED failures often involve de-bonding of the lens material from the cup or die surface due to thermal-expansion mismatch and thermal stress. The paper also appears to summarize other failure modes seen in SEM Lab LED work, including die attach failure, die cracking, wedge bond failure, and ball bond failure. The overall pattern is that many of these failures are induced by mechanical or thermo-mechanical stresses.", "failure_modes": [ "die cracking", "die-attach failure", "wire-bond failure", "lens debonding" ], "technologies": [ "LED failure analysis", "die attach failure", "die cracking", "wedge bond failure", "ball bond failure", "thermo-mechanical stress", "lens de-bonding" ], "materials": [ "semiconductor die", "bond wire", "lens polymer" ], "methods": [ "SEM", "component examination" ], "keywords": [ "LED failure analysis", "die attach failure", "die cracking", "wedge bond failure", "ball bond failure", "thermo-mechanical stress", "lens de-bonding", "die-attach failure", "wire-bond failure", "lens debonding", "semiconductor die", "bond wire", "lens polymer", "SEM", "component examination" ], "audience": [ "electronics failure-analysis engineers", "reliability engineers", "component engineers", "manufacturing engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "20.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/failure-analysis-of-leds.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0006", "slug": "failure-analysis-of-pcbas", "title": "Failure Analysis of PCBAs", "abstract": "This paper covers practical failure-analysis approaches for printed circuit board assemblies. The source page outlines a general workflow that includes documentation review, microscope examination, electrical isolation or verification of the failure, cross-sectioning for PWB-related failures, decapsulation or cross-sectioning for component-related failures, and SEM/EDS work to document the failure site and resolve root cause. The page also includes practical \"dos and don'ts\" intended to improve the timeliness and cost effectiveness of PCBA failure analysis. That makes the paper useful not only as a mechanism reference, but also as a guide to handling, documentation, and pre-analysis discipline.", "failure_modes": [ "contamination", "corrosion", "assembly failure" ], "technologies": [ "PCBA failure analysis", "documentation review", "stereomicroscope examination", "electrical verification", "cross-sectioning", "decapsulation", "contamination", "corrosion", "SEM/EDS", "failure-analysis workflow" ], "materials": [ "printed circuit board assemblies", "solder" ], "methods": [ "stereomicroscopy", "electrical verification", "cross-sectioning", "SEM", "EDS" ], "keywords": [ "PCBA failure analysis", "documentation review", "stereomicroscope examination", "electrical verification", "cross-sectioning", "decapsulation", "contamination", "corrosion", "SEM/EDS", "failure-analysis workflow", "assembly failure", "printed circuit board assemblies", "solder", "stereomicroscopy", "SEM", "EDS" ], "audience": [ "electronics failure-analysis engineers", "reliability engineers", "manufacturing engineers", "quality engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "25.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/failure-analysis-of-pcbas.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0012", "slug": "hasl-finish-on-pwb", "title": "HASL Finish on PWBs", "abstract": "This paper covers HASL finish on PWBs and fits the practical process side of the SEM Lab paper catalog. It belongs with the papers that help engineers evaluate assembly-related materials and process conditions before those conditions turn into field or manufacturing failures. The paper should be positioned as a useful reference for engineers dealing with solderability, surface-finish quality, and the effect of board finish condition on assembly results and longer-term reliability.", "failure_modes": [ "solderability degradation", "surface-finish defects" ], "technologies": [ "HASL finish on printed wiring boards", "solderability", "surface finish evaluation", "assembly quality", "process control", "PWB reliability" ], "materials": [ "HASL", "solder", "printed wiring board" ], "methods": [ "surface-finish evaluation", "solderability assessment" ], "keywords": [ "HASL finish on printed wiring boards", "solderability", "surface finish evaluation", "assembly quality", "process control", "PWB reliability", "solderability degradation", "surface-finish defects", "HASL", "solder", "printed wiring board", "surface-finish evaluation", "solderability assessment" ], "audience": [ "manufacturing engineers", "process engineers", "materials engineers", "quality engineers", "reliability engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "35.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/hasl-finish-on-pwb.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" } ] }