{
    "query": "Failure Analysis of BGAs",
    "total": 17,
    "limit": 10,
    "catalog_generated_at": "2026-08-01T15:46:10Z",
    "results": [
        {
            "report_id": "SEM-EVIDENCE-0004",
            "slug": "failure-analysis-of-bgas",
            "title": "Failure Analysis of BGAs",
            "abstract": "This paper covers practical approaches for failure analysis of Ball Grid Array devices. The source page describes BGA analysis as difficult because of the high I/O count and packaging density, and it positions the paper as a discussion of several BGA failure modes and analysis approaches that can be performed with a limited number of analytical tools. The paper also appears to distinguish between cases that can be addressed with limited tools such as a DMM, microsectioning, and SEM/EDS, and cases where more advanced work is needed to identify the failure cause.",
            "failure_modes": [
                "BGA open circuit",
                "BGA short circuit",
                "solder-joint fracture"
            ],
            "technologies": [
                "BGA failure analysis",
                "BGA solder-joint failure modes",
                "limited-tools analysis",
                "microsectioning",
                "SEM/EDS",
                "electrical screening"
            ],
            "materials": [
                "solder"
            ],
            "methods": [
                "electrical screening",
                "microsectioning",
                "SEM",
                "EDS"
            ],
            "keywords": [
                "BGA failure analysis",
                "BGA solder-joint failure modes",
                "limited-tools analysis",
                "microsectioning",
                "SEM/EDS",
                "electrical screening",
                "BGA open circuit",
                "BGA short circuit",
                "solder-joint fracture",
                "solder",
                "SEM",
                "EDS"
            ],
            "audience": [
                "electronics failure-analysis engineers",
                "reliability engineers",
                "manufacturing engineers",
                "component engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "45.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/failure-analysis-of-bgas.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0003",
            "slug": "failure-analysis-of-aluminum-electrolytic-capacitors",
            "title": "Failure Analysis of Aluminum Electrolytic Capacitors",
            "abstract": "This paper is described on the source page as a 21-page booklet summarizing the author's experience performing failure analysis on aluminum electrolytic capacitors over a fifteen-year period. It covers failure mechanisms seen in these capacitors and the failure-analysis techniques used to identify the failures. The source page also notes that the document includes figures, equations, and graphs. That makes it a deeper stand-alone technical reference rather than a short overview paper.",
            "failure_modes": [
                "capacitor failure"
            ],
            "technologies": [
                "failure analysis of aluminum electrolytic capacitors",
                "capacitor failure mechanisms",
                "analytical techniques",
                "figures",
                "equations",
                "graphs",
                "component failure analysis"
            ],
            "materials": [
                "aluminum electrolyte systems"
            ],
            "methods": [
                "component failure analysis"
            ],
            "keywords": [
                "failure analysis of aluminum electrolytic capacitors",
                "capacitor failure mechanisms",
                "analytical techniques",
                "figures",
                "equations",
                "graphs",
                "component failure analysis",
                "capacitor failure",
                "aluminum electrolyte systems"
            ],
            "audience": [
                "component engineers",
                "failure-analysis engineers",
                "reliability engineers",
                "manufacturing engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "105.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/failure-analysis-of-aluminum-electrolytic-capacitors.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0005",
            "slug": "failure-analysis-of-leds",
            "title": "Failure Analysis of LEDs",
            "abstract": "This paper covers recurring LED failure modes and the practical failure-analysis approach used to evaluate them. The source page describes intermittent or no-light symptoms, and it notes that LED failures often involve de-bonding of the lens material from the cup or die surface due to thermal-expansion mismatch and thermal stress. The paper also appears to summarize other failure modes seen in SEM Lab LED work, including die attach failure, die cracking, wedge bond failure, and ball bond failure. The overall pattern is that many of these failures are induced by mechanical or thermo-mechanical stresses.",
            "failure_modes": [
                "die cracking",
                "die-attach failure",
                "wire-bond failure",
                "lens debonding"
            ],
            "technologies": [
                "LED failure analysis",
                "die attach failure",
                "die cracking",
                "wedge bond failure",
                "ball bond failure",
                "thermo-mechanical stress",
                "lens de-bonding"
            ],
            "materials": [
                "semiconductor die",
                "bond wire",
                "lens polymer"
            ],
            "methods": [
                "SEM",
                "component examination"
            ],
            "keywords": [
                "LED failure analysis",
                "die attach failure",
                "die cracking",
                "wedge bond failure",
                "ball bond failure",
                "thermo-mechanical stress",
                "lens de-bonding",
                "die-attach failure",
                "wire-bond failure",
                "lens debonding",
                "semiconductor die",
                "bond wire",
                "lens polymer",
                "SEM",
                "component examination"
            ],
            "audience": [
                "electronics failure-analysis engineers",
                "reliability engineers",
                "component engineers",
                "manufacturing engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "20.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/failure-analysis-of-leds.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0006",
            "slug": "failure-analysis-of-pcbas",
            "title": "Failure Analysis of PCBAs",
            "abstract": "This paper covers practical failure-analysis approaches for printed circuit board assemblies. The source page outlines a general workflow that includes documentation review, microscope examination, electrical isolation or verification of the failure, cross-sectioning for PWB-related failures, decapsulation or cross-sectioning for component-related failures, and SEM/EDS work to document the failure site and resolve root cause. The page also includes practical \"dos and don'ts\" intended to improve the timeliness and cost effectiveness of PCBA failure analysis. That makes the paper useful not only as a mechanism reference, but also as a guide to handling, documentation, and pre-analysis discipline.",
            "failure_modes": [
                "contamination",
                "corrosion",
                "assembly failure"
            ],
            "technologies": [
                "PCBA failure analysis",
                "documentation review",
                "stereomicroscope examination",
                "electrical verification",
                "cross-sectioning",
                "decapsulation",
                "contamination",
                "corrosion",
                "SEM/EDS",
                "failure-analysis workflow"
            ],
            "materials": [
                "printed circuit board assemblies",
                "solder"
            ],
            "methods": [
                "stereomicroscopy",
                "electrical verification",
                "cross-sectioning",
                "SEM",
                "EDS"
            ],
            "keywords": [
                "PCBA failure analysis",
                "documentation review",
                "stereomicroscope examination",
                "electrical verification",
                "cross-sectioning",
                "decapsulation",
                "contamination",
                "corrosion",
                "SEM/EDS",
                "failure-analysis workflow",
                "assembly failure",
                "printed circuit board assemblies",
                "solder",
                "stereomicroscopy",
                "SEM",
                "EDS"
            ],
            "audience": [
                "electronics failure-analysis engineers",
                "reliability engineers",
                "manufacturing engineers",
                "quality engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "25.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/failure-analysis-of-pcbas.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0007",
            "slug": "failure-analysis-of-pwbs",
            "title": "Failure Analysis of PWBs",
            "abstract": "This paper covers common failure modes in PWBs and connects those failures back to board construction quality. The source page specifically identifies Hi-Pot failures, lamination failures, inner layer separation, corrosion failures, PTH copper-plating failures, and conductive anodic filament failures as part of the paper's scope. It also makes a practical point that construction analysis can be used to verify PWB quality before these issues become larger reliability or failure problems. That makes this paper useful both for failure analysis and for front-end quality verification.",
            "failure_modes": [
                "conductive anodic filament formation",
                "lamination failure",
                "inner-layer separation",
                "plated-through-hole failure",
                "corrosion"
            ],
            "technologies": [
                "printed wiring board failure analysis",
                "construction analysis",
                "PTH copper thickness",
                "CAF",
                "lamination failures",
                "inner layer separation",
                "corrosion failures",
                "drilled-hole quality"
            ],
            "materials": [
                "copper plating",
                "laminate"
            ],
            "methods": [
                "construction analysis",
                "cross-sectioning"
            ],
            "keywords": [
                "printed wiring board failure analysis",
                "construction analysis",
                "PTH copper thickness",
                "CAF",
                "lamination failures",
                "inner layer separation",
                "corrosion failures",
                "drilled-hole quality",
                "conductive anodic filament formation",
                "lamination failure",
                "inner-layer separation",
                "plated-through-hole failure",
                "corrosion",
                "copper plating",
                "laminate",
                "cross-sectioning"
            ],
            "audience": [
                "manufacturing engineers",
                "quality engineers",
                "reliability engineers",
                "failure-analysis engineers",
                "board-fabrication engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "50.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/failure-analysis-of-pwbs.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0009",
            "slug": "forward-voltage-signatures-in-electronic-component-failure-analysis",
            "title": "Forward-Voltage Signatures in Electronic Component Failure Analysis",
            "abstract": "This paper examines ten anonymized semiconductor and optoelectronic failure-analysis cases and organizes their electrical behavior into practical forward-voltage signature classes. It distinguishes near-zero voltage, open or elevated voltage, current-dependent elevation, depressed voltage, and nominal voltage with degraded function. The central engineering lesson is that forward voltage is a strong triage and localization measurement, but not a stand-alone root-cause determination. Controlled current and temperature, matched references, functional observations, and targeted physical analysis are needed to support a defensible conclusion.",
            "failure_modes": [
                "open circuit",
                "short circuit",
                "electrical degradation"
            ],
            "technologies": [
                "forward-voltage interpretation in component failure analysis",
                "diode testing",
                "LED failure",
                "electrical overstress",
                "series resistance",
                "die cracking",
                "wear-out",
                "SEM correlation"
            ],
            "materials": [
                "semiconductor junctions"
            ],
            "methods": [
                "forward-voltage measurement",
                "electrical screening"
            ],
            "keywords": [
                "forward-voltage interpretation in component failure analysis",
                "diode testing",
                "LED failure",
                "electrical overstress",
                "series resistance",
                "die cracking",
                "wear-out",
                "SEM correlation",
                "open circuit",
                "short circuit",
                "electrical degradation",
                "semiconductor junctions",
                "forward-voltage measurement",
                "electrical screening"
            ],
            "audience": [
                "failure-analysis engineers",
                "reliability engineers",
                "component engineers",
                "manufacturing engineers",
                "quality engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "25.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/forward-voltage-signatures-in-electronic-component-failure-analysis.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0013",
            "slug": "images-of-failures-in-microelectronics-packaging",
            "title": "Images of Failures in Microelectronics Packaging",
            "abstract": "This paper is positioned as a collection of failures seen at SEM Lab in microelectronics packaging. The source page states that it includes examples such as gold embrittlement, mechanical damage, solder-joint failure, black pad syndrome, and various other failure mechanisms. That makes the paper useful as a broad visual and mechanism-oriented reference rather than a narrowly focused single-topic treatment. It appears to function as a consolidated packaging-failure example set.",
            "failure_modes": [
                "gold embrittlement",
                "mechanical damage",
                "black pad",
                "solder-joint failure"
            ],
            "technologies": [
                "failures in microelectronics packaging",
                "gold embrittlement",
                "mechanical damage",
                "solder-joint failure",
                "black pad syndrome",
                "packaging failure mechanisms",
                "image examples"
            ],
            "materials": [
                "microelectronics packaging",
                "solder"
            ],
            "methods": [
                "SEM",
                "visual comparison"
            ],
            "keywords": [
                "failures in microelectronics packaging",
                "gold embrittlement",
                "mechanical damage",
                "solder-joint failure",
                "black pad syndrome",
                "packaging failure mechanisms",
                "image examples",
                "black pad",
                "microelectronics packaging",
                "solder",
                "SEM",
                "visual comparison"
            ],
            "audience": [
                "electronics failure-analysis engineers",
                "packaging engineers",
                "reliability engineers",
                "manufacturing engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "320.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/images-of-failures-in-microelectronics-packaging.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0018",
            "slug": "solder-joint-analysis",
            "title": "Solder Joint Analysis",
            "abstract": "This paper covers techniques for analyzing solder joints and highlights SEM Lab capabilities in solder-joint evaluation and failure analysis. The source page specifically identifies metallurgical cross-sectioning, SEM/EDS analysis, failure analysis, and computational metallurgical analysis as part of the paper's scope. The page also states that the analysis results are essential for credible design, process, and product failure analysis. That positions the paper as a broad solder-joint reference rather than a narrow mechanism note.",
            "failure_modes": [
                "solder-joint failure",
                "metallurgical defects"
            ],
            "technologies": [
                "solder joint analysis",
                "metallurgical cross-sectioning",
                "SEM/EDS",
                "solder-joint failure analysis",
                "computational metallurgical analysis",
                "design and process evaluation"
            ],
            "materials": [
                "solder",
                "intermetallic compounds"
            ],
            "methods": [
                "metallurgical cross-sectioning",
                "SEM",
                "EDS",
                "computational metallurgical analysis"
            ],
            "keywords": [
                "solder joint analysis",
                "metallurgical cross-sectioning",
                "SEM/EDS",
                "solder-joint failure analysis",
                "computational metallurgical analysis",
                "design and process evaluation",
                "solder-joint failure",
                "metallurgical defects",
                "solder",
                "intermetallic compounds",
                "SEM",
                "EDS"
            ],
            "audience": [
                "failure-analysis engineers",
                "manufacturing engineers",
                "materials engineers",
                "reliability engineers",
                "product engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "55.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/solder-joint-analysis.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0011",
            "slug": "gold-embrittlement-of-solder-joints",
            "title": "Gold Embrittlement of Solder Joints",
            "abstract": "This paper covers gold embrittlement of solder joints as a recurring and still significant electronics failure-analysis problem. The source page notes that gold-embrittlement-related failures represent a significant portion of the work analyzed at SEM Lab and states that the paper provides a detailed account of material and process parameters that can lead to this condition in electronic assemblies. The paper appears to be positioned both as a practical failure-analysis reference and as a prevention-oriented document for understanding how solder-joint design and process choices can avoid embrittlement problems.",
            "failure_modes": [
                "gold embrittlement",
                "brittle solder-joint fracture"
            ],
            "technologies": [
                "gold embrittlement in solder joints",
                "solder-joint failure",
                "intermetallic compounds",
                "process parameters",
                "material parameters",
                "electronic assemblies"
            ],
            "materials": [
                "gold",
                "solder",
                "intermetallic compounds"
            ],
            "methods": [
                "metallographic cross-sectioning",
                "SEM",
                "EDS"
            ],
            "keywords": [
                "gold embrittlement in solder joints",
                "solder-joint failure",
                "intermetallic compounds",
                "process parameters",
                "material parameters",
                "electronic assemblies",
                "gold embrittlement",
                "brittle solder-joint fracture",
                "gold",
                "solder",
                "metallographic cross-sectioning",
                "SEM",
                "EDS"
            ],
            "audience": [
                "electronics failure-analysis engineers",
                "manufacturing engineers",
                "materials engineers",
                "reliability engineers"
            ],
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            ],
            "price": {
                "amount": "60.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/gold-embrittlement-of-solder-joints.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0019",
            "slug": "solder-flux-associated-failures-sample-report",
            "title": "Solder-Flux-Associated Failures in Electronic Assemblies",
            "abstract": "This free 10-page sample report demonstrates how SEM Lab connects electrical behavior, failure-site location, SEM imaging, EDS chemistry, process history, and evidence limits in a clear technical deliverable. Six anonymized cases show how retained solder-flux residue can contribute to moisture-sensitive leakage, corrosion, electrochemical migration, and combined manufacturing defects. The report also provides a failure-analysis sequence and practical process controls. It is published as a composite marketing example so prospective clients can evaluate the structure, evidence traceability, and calibrated conclusion language used in SEM Lab technical reporting.",
            "failure_modes": [
                "moisture-sensitive leakage",
                "corrosion",
                "electrochemical migration",
                "flux entrapment"
            ],
            "technologies": [
                "solder-flux-associated failures in electronic assemblies",
                "flux residue",
                "corrosion",
                "electrochemical migration",
                "electrical leakage",
                "cleaning",
                "drying",
                "SEM",
                "EDS",
                "evidence interpretation"
            ],
            "materials": [
                "solder flux residue",
                "copper",
                "immersion silver",
                "solder mask"
            ],
            "methods": [
                "electrical testing",
                "optical microscopy",
                "SEM",
                "EDS",
                "cross-sectioning",
                "ion chromatography"
            ],
            "keywords": [
                "solder-flux-associated failures in electronic assemblies",
                "flux residue",
                "corrosion",
                "electrochemical migration",
                "electrical leakage",
                "cleaning",
                "drying",
                "SEM",
                "EDS",
                "evidence interpretation",
                "moisture-sensitive leakage",
                "flux entrapment",
                "solder flux residue",
                "copper",
                "immersion silver",
                "solder mask",
                "electrical testing",
                "optical microscopy",
                "cross-sectioning",
                "ion chromatography"
            ],
            "audience": [
                "failure-analysis engineers",
                "manufacturing engineers",
                "process engineers",
                "reliability engineers",
                "quality engineers",
                "technical managers"
            ],
            "availability": [
                "free_public_download"
            ],
            "price": null,
            "purchase_url": "https://www.semlab.com/assets/sample-report/solder-flux-associated-failures-sample-report.pdf",
            "page_url": "https://www.semlab.com/sample-failure-analysis-report.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        }
    ]
}