{
    "query": "BGA Assembly Verification",
    "total": 6,
    "limit": 10,
    "catalog_generated_at": "2026-08-01T15:46:10Z",
    "results": [
        {
            "report_id": "SEM-EVIDENCE-0001",
            "slug": "bga-assembly-verification",
            "title": "BGA Assembly Verification",
            "abstract": "This paper covers BGA assembly verification using microsection and SEM analysis. The source page makes the practical purpose clear: the work is used to optimize assembly processes early in the product development cycle and help prevent failure during production. That makes this paper more than a narrow inspection note. It is a process-validation reference for engineers who need to verify that BGA assembly quality is adequate before product release or volume manufacturing.",
            "failure_modes": [
                "solder-joint quality defects"
            ],
            "technologies": [
                "BGA assembly verification",
                "microsection analysis",
                "SEM analysis",
                "assembly validation",
                "process optimization",
                "solder-joint quality"
            ],
            "materials": [
                "solder"
            ],
            "methods": [
                "microsectioning",
                "SEM"
            ],
            "keywords": [
                "BGA assembly verification",
                "microsection analysis",
                "SEM analysis",
                "assembly validation",
                "process optimization",
                "solder-joint quality",
                "solder-joint quality defects",
                "solder",
                "microsectioning",
                "SEM"
            ],
            "audience": [
                "manufacturing engineers",
                "process engineers",
                "quality engineers",
                "product engineers",
                "reliability engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "25.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/bga-assembly-verification.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0004",
            "slug": "failure-analysis-of-bgas",
            "title": "Failure Analysis of BGAs",
            "abstract": "This paper covers practical approaches for failure analysis of Ball Grid Array devices. The source page describes BGA analysis as difficult because of the high I/O count and packaging density, and it positions the paper as a discussion of several BGA failure modes and analysis approaches that can be performed with a limited number of analytical tools. The paper also appears to distinguish between cases that can be addressed with limited tools such as a DMM, microsectioning, and SEM/EDS, and cases where more advanced work is needed to identify the failure cause.",
            "failure_modes": [
                "BGA open circuit",
                "BGA short circuit",
                "solder-joint fracture"
            ],
            "technologies": [
                "BGA failure analysis",
                "BGA solder-joint failure modes",
                "limited-tools analysis",
                "microsectioning",
                "SEM/EDS",
                "electrical screening"
            ],
            "materials": [
                "solder"
            ],
            "methods": [
                "electrical screening",
                "microsectioning",
                "SEM",
                "EDS"
            ],
            "keywords": [
                "BGA failure analysis",
                "BGA solder-joint failure modes",
                "limited-tools analysis",
                "microsectioning",
                "SEM/EDS",
                "electrical screening",
                "BGA open circuit",
                "BGA short circuit",
                "solder-joint fracture",
                "solder",
                "SEM",
                "EDS"
            ],
            "audience": [
                "electronics failure-analysis engineers",
                "reliability engineers",
                "manufacturing engineers",
                "component engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "45.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/failure-analysis-of-bgas.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0006",
            "slug": "failure-analysis-of-pcbas",
            "title": "Failure Analysis of PCBAs",
            "abstract": "This paper covers practical failure-analysis approaches for printed circuit board assemblies. The source page outlines a general workflow that includes documentation review, microscope examination, electrical isolation or verification of the failure, cross-sectioning for PWB-related failures, decapsulation or cross-sectioning for component-related failures, and SEM/EDS work to document the failure site and resolve root cause. The page also includes practical \"dos and don'ts\" intended to improve the timeliness and cost effectiveness of PCBA failure analysis. That makes the paper useful not only as a mechanism reference, but also as a guide to handling, documentation, and pre-analysis discipline.",
            "failure_modes": [
                "contamination",
                "corrosion",
                "assembly failure"
            ],
            "technologies": [
                "PCBA failure analysis",
                "documentation review",
                "stereomicroscope examination",
                "electrical verification",
                "cross-sectioning",
                "decapsulation",
                "contamination",
                "corrosion",
                "SEM/EDS",
                "failure-analysis workflow"
            ],
            "materials": [
                "printed circuit board assemblies",
                "solder"
            ],
            "methods": [
                "stereomicroscopy",
                "electrical verification",
                "cross-sectioning",
                "SEM",
                "EDS"
            ],
            "keywords": [
                "PCBA failure analysis",
                "documentation review",
                "stereomicroscope examination",
                "electrical verification",
                "cross-sectioning",
                "decapsulation",
                "contamination",
                "corrosion",
                "SEM/EDS",
                "failure-analysis workflow",
                "assembly failure",
                "printed circuit board assemblies",
                "solder",
                "stereomicroscopy",
                "SEM",
                "EDS"
            ],
            "audience": [
                "electronics failure-analysis engineers",
                "reliability engineers",
                "manufacturing engineers",
                "quality engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "25.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/failure-analysis-of-pcbas.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0012",
            "slug": "hasl-finish-on-pwb",
            "title": "HASL Finish on PWBs",
            "abstract": "This paper covers HASL finish on PWBs and fits the practical process side of the SEM Lab paper catalog. It belongs with the papers that help engineers evaluate assembly-related materials and process conditions before those conditions turn into field or manufacturing failures. The paper should be positioned as a useful reference for engineers dealing with solderability, surface-finish quality, and the effect of board finish condition on assembly results and longer-term reliability.",
            "failure_modes": [
                "solderability degradation",
                "surface-finish defects"
            ],
            "technologies": [
                "HASL finish on printed wiring boards",
                "solderability",
                "surface finish evaluation",
                "assembly quality",
                "process control",
                "PWB reliability"
            ],
            "materials": [
                "HASL",
                "solder",
                "printed wiring board"
            ],
            "methods": [
                "surface-finish evaluation",
                "solderability assessment"
            ],
            "keywords": [
                "HASL finish on printed wiring boards",
                "solderability",
                "surface finish evaluation",
                "assembly quality",
                "process control",
                "PWB reliability",
                "solderability degradation",
                "surface-finish defects",
                "HASL",
                "solder",
                "printed wiring board",
                "surface-finish evaluation",
                "solderability assessment"
            ],
            "audience": [
                "manufacturing engineers",
                "process engineers",
                "materials engineers",
                "quality engineers",
                "reliability engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "35.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/hasl-finish-on-pwb.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0016",
            "slug": "solder-flux-residue-part-1",
            "title": "Solder Flux Residue - Part 1",
            "abstract": "This paper covers solder flux residue left on printed circuit board assemblies and the problems it can cause, including corrosion, electro-chemical migration, electrical leakage, and short-circuit faults. The source page also makes clear that the paper investigates what conclusions can be drawn from EDS data for solder flux residue. That gives the paper practical value beyond simple contamination awareness. It helps connect residue, analytical evidence, and engineering interpretation in cases where the contamination mechanism matters.",
            "failure_modes": [
                "corrosion",
                "electrochemical migration",
                "electrical leakage",
                "short circuit"
            ],
            "technologies": [
                "solder flux residue",
                "corrosion",
                "electro-chemical migration",
                "electrical leakage",
                "short-circuit faults",
                "SEM/EDS interpretation"
            ],
            "materials": [
                "solder flux residue",
                "printed circuit board assembly"
            ],
            "methods": [
                "SEM",
                "EDS"
            ],
            "keywords": [
                "solder flux residue",
                "corrosion",
                "electro-chemical migration",
                "electrical leakage",
                "short-circuit faults",
                "SEM/EDS interpretation",
                "electrochemical migration",
                "short circuit",
                "printed circuit board assembly",
                "SEM",
                "EDS"
            ],
            "audience": [
                "failure-analysis engineers",
                "manufacturing engineers",
                "quality engineers",
                "materials engineers",
                "reliability engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "15.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/solder-flux-residue-part-1.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        },
        {
            "report_id": "SEM-EVIDENCE-0007",
            "slug": "failure-analysis-of-pwbs",
            "title": "Failure Analysis of PWBs",
            "abstract": "This paper covers common failure modes in PWBs and connects those failures back to board construction quality. The source page specifically identifies Hi-Pot failures, lamination failures, inner layer separation, corrosion failures, PTH copper-plating failures, and conductive anodic filament failures as part of the paper's scope. It also makes a practical point that construction analysis can be used to verify PWB quality before these issues become larger reliability or failure problems. That makes this paper useful both for failure analysis and for front-end quality verification.",
            "failure_modes": [
                "conductive anodic filament formation",
                "lamination failure",
                "inner-layer separation",
                "plated-through-hole failure",
                "corrosion"
            ],
            "technologies": [
                "printed wiring board failure analysis",
                "construction analysis",
                "PTH copper thickness",
                "CAF",
                "lamination failures",
                "inner layer separation",
                "corrosion failures",
                "drilled-hole quality"
            ],
            "materials": [
                "copper plating",
                "laminate"
            ],
            "methods": [
                "construction analysis",
                "cross-sectioning"
            ],
            "keywords": [
                "printed wiring board failure analysis",
                "construction analysis",
                "PTH copper thickness",
                "CAF",
                "lamination failures",
                "inner layer separation",
                "corrosion failures",
                "drilled-hole quality",
                "conductive anodic filament formation",
                "lamination failure",
                "inner-layer separation",
                "plated-through-hole failure",
                "corrosion",
                "copper plating",
                "laminate",
                "cross-sectioning"
            ],
            "audience": [
                "manufacturing engineers",
                "quality engineers",
                "reliability engineers",
                "failure-analysis engineers",
                "board-fabrication engineers"
            ],
            "availability": [
                "individual_purchase"
            ],
            "price": {
                "amount": "50.00",
                "currency": "USD"
            },
            "purchase_url": "https://www.semlab.com/papers.html#catalog",
            "page_url": "https://www.semlab.com/reports/failure-analysis-of-pwbs.html",
            "author": "Ed Hare, PhD",
            "publisher": "SEM Lab, Inc.",
            "date_modified": "2026-08-01"
        }
    ]
}