Failure Analysis of PWBs

Printed Wiring Boards (PWBs)

 

SEM Lab’s engineers have experience performing failure analysis of PWBs beginning in 1988.  We have performed hundreds of individual failure analyses on PWBs and have accumulated a significant database of the variety of failure modes and mechanisms involved in PWB failures.

SEM images of failures in printed wiring boards (PWBs) and defects in the PWB surface finish are shown below.

 

ELECTRONIC COMPONENT F/A

FAILURE ANALYSIS SERVICES

Other device failure analysis information:


pwbs

Inner layer separation.

Inner layer separation.

Suspect micro-via.

Suspect micro-via.

PWB construction analysis for conductor layer thickness, dielectric thickness, plated copper thickness, layer-to-layer and registration.

Registration problem.

CAF failure planar section.

CAF failure planar section.

pwb surface finish

Poor HASL finish.

Poor HASL finish.

ENIG 250 uin Ni-8 uin Au..

Sn whisker on flex circuit.

Sn whisker on flex circuit.