Failure Analysis of LEDs

Light Emitting Diodes (LEDs)

 

The primary failure modes we have seen in doing failure analysis of LEDs at SEM Lab, Inc. are related to thermal-mechanical stress that causes die attachment failure, wire bond and bond wire failures, and seal integrity problems.

SEM images and optical images of failures in light emitting diodes (LEDs) are shown below.

 

ELECTRONIC COMPONENT F/A

FAILURE ANALYSIS SERVICES

Other device failure analysis information:


LEDs

RGB LED side view.

RGB LED optical image.

RGB LED optical image..

LED die microsection.

Wedge bond at post.

Wedge bond at post.

ESD damage at contact edge.

ESD damage at contact edge.

Suspect die attach.

Suspect die attach.