Failure Analysis of Inductors

Inductor Failures

Failure analysis of inductors involves a combination of x-ray imaging, dissection, microsectioning, optical microscopy, and SEM/EDS analysis in order to isolate and characterize the root cause of the failure, since inductors are very often potted in an encapsulant. Inductors often fail open due to corrosion or bad internal solder joints or the inductors fail shorted due to electrical overstress, bad magnet wire insulation, or potting issues.

Some images of common inductor failures are shown below.  

ELECTRONIC COMPONENT F/A

FAILURE ANALYSIS SERVICES

Other device failure analysis information:


inductors

Surface Mount Device (SMD) inductor.

Surface Mount Device (SMD) inductor.

 

Voids in encapsulant.

Voids in encapsulant.

 

Conductor corrosion.

Conductor corrosion.