Failure Analysis of ICs

Integrated Circuits (ICs)

 

Failure analysis of ICs typically involves external examination, continuity testing, chemical decapsulation, and SEM/EDS analysis of the device die.

SEM images of failures in integrated circuits (ICs) and a decapsulated IC are shown below.

 

ELECTRONIC COMPONENT F/A

FAILURE ANALYSIS SERVICES

Other device failure analysis information:


ics

Decapsulated IC.

Decapsulated IC.

EOS Failure.

ESD Failure.

ESD Failure.

Bond pad corrosion.

Bond pad corrosion.

Dendritic growth.

Lifted ball bond.

IC

EOS failure of MOSFET.