Failure Analysis of BGAs

Ball Grid Arrays (BGAs)

 

Most BGA failures examined at SEM Lab, Inc. have been related to warpage issues, black-pad-syndrome, brittle interfacial fracture, and assembly level process issues.

SEM images of a BGA cross-section and failures seen in Ball Grid Arrays (BGAs) are shown below.

 

ELECTRONIC COMPONENT F/A

FAILURE ANALYSIS SERVICES

Other device failure analysis information:


bgas

BGA joint microsection.

Brittle interfacial fracture.

Brittle interfacial fracture.

Solder ball composition.