Images of Failures in Microelectronics Packaging

This paper is a collection of failures seen at SEM Lab, Inc., and include gold embrittlement, mechanical damage, solder joint failure, black pad syndrome, and various other failure mechanisms.

Images of Failures in Microelectronics Packaging (pdf file)

To see SEM images of other failed components visit our electronic component failure analysis page



A complete listing of all the papers on this site can be found here.