Failure Analysis of LEDs

A significant number of intermittent LEDs have been analyzed at SEM Lab, Inc. Below is a summary paper describing various failure modes that have been seen here at SEM Lab, Inc. These failures resulted in intermittent conditions and included die attach failure, die cracking, wedge bond failure and ball bond failure. In most cases, these failures are induced by mechanical or thermo-mechanical stresses.

Failure Analysis of LEDs (pdf file)



To see SEM images of failed LEDs visit our Failure Analysis of LEDs page.



A complete listing of all the papers on this site can be found here.