Solder Joint Analysis

Solder joint analysis is an important factor in determining the reliability of electronic assemblies. Solder can contribute to thermal, mechanical and electrical variations in devices and assemblies. SEM Lab, Inc. has extensive experience in solder joint metallurgical, quality and reliability analysis.

Solder Joint Reliability Analysis

SEM Lab, Inc. does detailed root cause analysis of solder joint failures which includes gold embrittlement, tin whiskers, electromigration, corrosion, intermetallic compounds, and black-pad-syndrome.

Solder Composition Analysis

The amount of lead (Pb) in solder joints can affect reliability. Lead-tin (Pb-Sn) surface finishes on electronics components should have a minimum of 3% Pb to avoid tin whiskers. SEM Lab, Inc. uses SEM/EDS data from Sn-Pb standards to verify the solder composition.

Solder Failure
Organic particles on solder bumps.
Solder Composition
This termination is 100% tin.
Lead Free Solder
Lead-free solder.