Materials Analysis Service

SEM Lab, Inc. performs materials analysis, identification and characterization of a wide variety of materials and processes. Materials such as metals, plastics, ceramics, glasses, and particles are commonly examined.

HDI Micro-Via
HDI micro-via quality evaluation.
Paper Contaminant
Particle contaminant on printer paper.
Dielectric Void
Dielectric void in an MLCC.
Solder Joint Failure
BGA Solder joint failure.

Materials Analysis

In addition to Scanning Electron Microscopy (SEM) analysis and optical microscopy, SEM Lab, Inc. uses Energy Dispersive X-ray (EDX or EDS) analysis in conjunction with Fourier Transform Infrared Spectroscopy (FTIR) analysis to identify and characterize materials. More details about these services can be found here:

EDS Analysis

FTIR Analysis

SEM Analysis

Optical Microscopy

Particle Analysis

Fiber Analysis

Electronic Materials and Process Analysis

SEM Lab, Inc. specializes in electronic materials and process characterization such as plating thickness and metallurgical evaluation, microstructural characterization, particle composition and shape characterization. We can provide expert materials support for electronic design and development, first article inspection, and lot-to-lot quality evaluations.

SEM Lab, Inc. also provides solder joint analysis and printed wiring board (PWB) construction analysis. More details about these services can be found here:

Solder Joint Analysis

PWB Construction Analysis