Materials Analysis Service
SEM Lab, Inc. performs materials analysis, identification
and characterization of a wide variety of materials and processes.
Materials such as metals, plastics, ceramics, glasses,
and particles are commonly examined.
- General Materials Analysis
- Electronic Materials and Process Analysis
HDI micro-via quality evaluation.
Particle contaminant on printer paper.
Dielectric void in an MLCC.
BGA Solder joint failure.
Electronic Materials and Process Analysis
SEM Lab, Inc. specializes in electronic materials and process
characterization such as plating thickness and metallurgical evaluation,
microstructural characterization, particle composition and shape
characterization. We can provide expert materials support for
electronic design and development, first article inspection,
and lot-to-lot quality evaluations.
SEM Lab, Inc. also provides solder joint analysis and printed wiring board
(PWB) construction analysis. More details about these services
can be found here:
Solder Joint Analysis
PWB Construction Analysis