Device Analysis Examples
(click on image to enlarge)
Delamination of PWB.
Electrical overstress damage (EOS damage.
Light Emitting Diode (LED)failure.
Gold wire bond.
Exposed Copper at Plated Thru-Hole
Cu-Sn intermetallic compound.
SMT device with wetting problem.
Particle residue in dissected relay device.
PWB Failure Analysis.
PWB construction analysis.
EOS failure resulting in fused wire bond.
Failure analysis of a PCB.
Dielectric void in BME.
Flexure crack in MLCC.
Transistor failure.
Capacitor failure.
