A client provided two sensor assemblies for failure analysis of capacitor C4 on the internal PCBA.
This is an optical micrograph of the capacitor as mounted on the PCBA.
This is an optical image of an intermediate grinding stage during microsection preparation. A bending fracture was noted under one of the terminations.
This is a BSE SEM image of the capacitor microsection.
The fracture appeared to be due to flexure of the PCBA.
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